Intel Corporation
EP3SE260F1517I4G
EP3SE260F1517I4G ECAD Model
EP3SE260F1517I4G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 976 | |
| Number of Outputs | 976 | |
| Number of Logic Cells | 255000 | |
| Number of CLBs | 10200 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 10200 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1517 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE260F1517I4G Datasheet Download
EP3SE260F1517I4G Overview
The chip model EP3SE260F1517I4G is a versatile integrated circuit (IC) with powerful capabilities for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (Hardware Description Language) programming language, and is suitable for a wide range of applications.
In terms of industry trends, the EP3SE260F1517I4G chip model is becoming increasingly popular in many industries. This is due to its ability to handle complex tasks with ease, and its ability to be programmed with a wide range of languages. As a result, it is becoming increasingly popular in industries such as automotive, aerospace, and medical.
The EP3SE260F1517I4G chip model can also be used in the development and popularization of future intelligent robots. This is because it has the ability to process large amounts of data quickly, and can be programmed with a wide range of languages. As a result, it can be used to develop sophisticated algorithms and software that can be used to control robots.
In order to effectively use the EP3SE260F1517I4G chip model, it requires a certain level of technical talent. This includes a deep understanding of HDL programming language, as well as knowledge of the specific application environment that the chip model is used in. Additionally, knowledge of new technologies that may be required to support the application environment may also be necessary.
Overall, the EP3SE260F1517I4G chip model is a powerful and versatile IC with many applications in a wide range of industries. It is becoming increasingly popular in many industries, and can be used to develop and popularize future intelligent robots. However, it requires a certain level of technical talent to effectively use the model, and knowledge of new technologies may be necessary to support the application environment.
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3,915 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $15,794.1751 | $15,794.1751 |
| 10+ | $15,624.3453 | $156,243.4528 |
| 100+ | $14,775.1961 | $1,477,519.6080 |
| 1000+ | $13,926.0469 | $6,963,023.4400 |
| 10000+ | $12,737.2380 | $12,737,238.0000 |
| The price is for reference only, please refer to the actual quotation! | ||