
Intel Corporation
EP3SE260F1517C4LN
EP3SE260F1517C4LN ECAD Model
EP3SE260F1517C4LN Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 976 | |
Number of Outputs | 976 | |
Number of Logic Cells | 255000 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Clock Frequency-Max | 717 MHz | |
Power Supplies | 1.2/3.3 V | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.9 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | LEAD FREE, FBGA-1517 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SE260F1517C4LN Datasheet Download
EP3SE260F1517C4LN Overview
The chip model EP3SE260F1517C4LN is a highly advanced and versatile chip model, designed to provide powerful and reliable performance for various applications. It is a multi-core system-on-chip (SoC) with a high-performance processor, memory, and peripheral controllers. This chip model is designed to support the latest technologies and is suitable for a wide range of applications, such as communication systems, networks, and intelligent systems.
The chip model EP3SE260F1517C4LN is designed to be highly flexible and upgradeable, allowing for future upgrades and improvements. It is designed to be used in the latest communication systems and networks, such as 5G, and is capable of supporting the latest intelligent scenarios. The chip model is designed to be used in the era of fully intelligent systems and is capable of providing a high level of performance and reliability.
The industry trends of the chip model EP3SE260F1517C4LN and the future development of related industries depend on what specific technologies are needed. The chip model is designed to be highly flexible and upgradeable, allowing for future upgrades and improvements. It is capable of supporting the latest technologies and is suitable for a wide range of applications, such as communication systems, networks, and intelligent systems.
The chip model EP3SE260F1517C4LN is designed to be used in the latest communication systems and networks, such as 5G, and is capable of supporting the latest intelligent scenarios. It is also capable of being used in the era of fully intelligent systems and is capable of providing a high level of performance and reliability. The chip model is designed to be highly flexible and upgradeable, allowing for future upgrades and improvements.
In conclusion, the chip model EP3SE260F1517C4LN is designed to be highly flexible and upgradeable, allowing for future upgrades and improvements. It is designed to be used in the latest communication systems and networks, such as 5G, and is capable of supporting the latest intelligent scenarios. The industry trends of the chip model EP3SE260F1517C4LN and the future development of related industries depend on what specific technologies are needed. It is also capable of being used in the era of fully intelligent systems and is capable of providing a high level of performance and reliability.
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1,052 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $10,124.9584 | $10,124.9584 |
10+ | $10,016.0878 | $100,160.8784 |
100+ | $9,471.7352 | $947,173.5240 |
1000+ | $8,927.3826 | $4,463,691.3200 |
10000+ | $8,165.2890 | $8,165,289.0000 |
The price is for reference only, please refer to the actual quotation! |