EP3SE260F1517C4LG
EP3SE260F1517C4LG
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rohs

Intel Corporation

EP3SE260F1517C4LG


EP3SE260F1517C4LG
F18-EP3SE260F1517C4LG
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-1517
FBGA-1517

EP3SE260F1517C4LG ECAD Model


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EP3SE260F1517C4LG Attributes


Type Description Select
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Logic Cells 255000
Number of CLBs 10200
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 10200 CLBS
Additional Feature ALSO OPERATES AT 1.1V VCC NOMINAL
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B1517
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.7 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-1517
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SE260F1517C4LG Datasheet Download


EP3SE260F1517C4LG Overview



The chip model EP3SE260F1517C4LG is a high-performance programmable logic device (PLD) designed by Altera Corporation, a leading provider of programmable logic solutions. It is a powerful, low-cost, and easy-to-use solution for embedded system design. It is suitable for a wide range of applications, including automotive, consumer electronics, industrial automation, medical instrumentation, and more.


The EP3SE260F1517C4LG chip model offers a number of advantages over traditional PLDs. It is designed for high-speed operation and low power consumption, making it ideal for applications where speed and efficiency are critical. It also supports advanced features such as logic optimization and fault tolerance, which are essential for reliable and robust operation in embedded systems. Additionally, the chip model is highly scalable, allowing designers to increase the number of logic elements as needed to meet their application requirements.


In terms of future industry trends, the EP3SE260F1517C4LG chip model is expected to be widely used in a variety of embedded applications. The chip model’s high performance and scalability make it an ideal choice for applications that require a high degree of flexibility and performance. Additionally, the chip model is expected to become increasingly popular in embedded systems that require low power consumption and high speed operation.


In terms of application environment, the EP3SE260F1517C4LG chip model can be used to support the development and popularization of future intelligent robots. It is capable of supporting a wide range of features, including complex logic and control functions, which are essential for the development of advanced robotic systems. Additionally, the chip model supports advanced features such as fault tolerance, which are critical for the reliable operation of robotic systems.


In order to effectively use the EP3SE260F1517C4LG chip model, designers must have a thorough understanding of embedded system design and programming. Additionally, they must be familiar with the chip model’s features and capabilities in order to make the most of its potential. Furthermore, designers should also have a good grasp of the application environment in which the chip model will be used, in order to ensure that it is used to its fullest potential.



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Unit Price: $19,596.584
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Pricing (USD)

QTY Unit Price Ext Price
1+ $18,224.8231 $18,224.8231
10+ $18,028.8573 $180,288.5728
100+ $17,049.0281 $1,704,902.8080
1000+ $16,069.1989 $8,034,599.4400
10000+ $14,697.4380 $14,697,438.0000
The price is for reference only, please refer to the actual quotation!

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