
Intel Corporation
EP3SE260F1517C4LG
EP3SE260F1517C4LG ECAD Model
EP3SE260F1517C4LG Attributes
Type | Description | Select |
---|---|---|
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Logic Cells | 255000 | |
Number of CLBs | 10200 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 10200 CLBS | |
Additional Feature | ALSO OPERATES AT 1.1V VCC NOMINAL | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.7 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1517 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SE260F1517C4LG Datasheet Download
EP3SE260F1517C4LG Overview
The chip model EP3SE260F1517C4LG is a high-performance programmable logic device (PLD) designed by Altera Corporation, a leading provider of programmable logic solutions. It is a powerful, low-cost, and easy-to-use solution for embedded system design. It is suitable for a wide range of applications, including automotive, consumer electronics, industrial automation, medical instrumentation, and more.
The EP3SE260F1517C4LG chip model offers a number of advantages over traditional PLDs. It is designed for high-speed operation and low power consumption, making it ideal for applications where speed and efficiency are critical. It also supports advanced features such as logic optimization and fault tolerance, which are essential for reliable and robust operation in embedded systems. Additionally, the chip model is highly scalable, allowing designers to increase the number of logic elements as needed to meet their application requirements.
In terms of future industry trends, the EP3SE260F1517C4LG chip model is expected to be widely used in a variety of embedded applications. The chip model’s high performance and scalability make it an ideal choice for applications that require a high degree of flexibility and performance. Additionally, the chip model is expected to become increasingly popular in embedded systems that require low power consumption and high speed operation.
In terms of application environment, the EP3SE260F1517C4LG chip model can be used to support the development and popularization of future intelligent robots. It is capable of supporting a wide range of features, including complex logic and control functions, which are essential for the development of advanced robotic systems. Additionally, the chip model supports advanced features such as fault tolerance, which are critical for the reliable operation of robotic systems.
In order to effectively use the EP3SE260F1517C4LG chip model, designers must have a thorough understanding of embedded system design and programming. Additionally, they must be familiar with the chip model’s features and capabilities in order to make the most of its potential. Furthermore, designers should also have a good grasp of the application environment in which the chip model will be used, in order to ensure that it is used to its fullest potential.
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1,807 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $18,224.8231 | $18,224.8231 |
10+ | $18,028.8573 | $180,288.5728 |
100+ | $17,049.0281 | $1,704,902.8080 |
1000+ | $16,069.1989 | $8,034,599.4400 |
10000+ | $14,697.4380 | $14,697,438.0000 |
The price is for reference only, please refer to the actual quotation! |