EP3SE260F1517C4L
EP3SE260F1517C4L
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

EP3SE260F1517C4L


EP3SE260F1517C4L
F18-EP3SE260F1517C4L
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-1517
FBGA-1517

EP3SE260F1517C4L ECAD Model


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EP3SE260F1517C4L Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 976
Number of Outputs 976
Number of Logic Cells 255000
Number of CLBs 10200
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 10200 CLBS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Power Supplies 1.2/3.3 V
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B1517
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.7 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-1517
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SE260F1517C4L Datasheet Download


EP3SE260F1517C4L Overview



The chip model EP3SE260F1517C4L is a high-performance FPGA, designed to provide users with the ability to implement high-performance digital signal processing, embedded processing, image processing, and more. It is based on the latest Altera Stratix III FPGA technology, and requires the use of HDL (Hardware Description Language) for programming.


The design intention of the EP3SE260F1517C4L is to provide users with an FPGA that can deliver high performance and flexibility, allowing for the creation of complex designs and applications. The chip model features a wide range of features, including high-speed transceivers, high-speed memory interfaces, high-speed DSP blocks, and more. The EP3SE260F1517C4L is designed to be upgradeable, allowing users to take advantage of new features as they become available.


The EP3SE260F1517C4L is also suitable for advanced communication systems, providing users with the ability to implement high-speed communication protocols. The chip model can be used to create systems that are capable of transmitting and receiving data at high speeds, making it ideal for applications such as wireless communication, data transmission, and more.


The product description of the EP3SE260F1517C4L includes a detailed list of features, as well as detailed design requirements. This includes a list of the components that must be included in the design, as well as the necessary connections and configurations. In addition, the product description also includes information on the performance and power consumption of the chip model.


In order to ensure that designs created with the EP3SE260F1517C4L are successful, it is important to follow the design requirements carefully. This includes ensuring that the components are correctly connected and configured, and that the design is optimized for the best performance. It is also important to consider the power consumption of the chip model, as this will affect the overall performance of the design.


To provide users with a better understanding of the EP3SE260F1517C4L, case studies can be used to demonstrate how the chip model can be used in a variety of applications. These case studies can provide users with an insight into the capabilities of the chip model, as well as the benefits of using it in various applications.


In conclusion, the EP3SE260F1517C4L is a high-performance FPGA that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It is designed to be upgradeable, allowing users to take advantage of new features as they become available. The product description and design requirements must be followed carefully to ensure that the design is successful, and case studies can be used to provide users with a better understanding of the chip model and its capabilities.



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Unit Price: $11,975.7576
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Pricing (USD)

QTY Unit Price Ext Price
1+ $11,137.4546 $11,137.4546
10+ $11,017.6970 $110,176.9699
100+ $10,418.9091 $1,041,890.9112
1000+ $9,820.1212 $4,910,060.6160
10000+ $8,981.8182 $8,981,818.2000
The price is for reference only, please refer to the actual quotation!

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