
Intel Corporation
EP3SE260F1517C4L
EP3SE260F1517C4L ECAD Model
EP3SE260F1517C4L Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 976 | |
Number of Outputs | 976 | |
Number of Logic Cells | 255000 | |
Number of CLBs | 10200 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 10200 CLBS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Power Supplies | 1.2/3.3 V | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.7 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1517 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SE260F1517C4L Datasheet Download
EP3SE260F1517C4L Overview
The chip model EP3SE260F1517C4L is a high-performance FPGA, designed to provide users with the ability to implement high-performance digital signal processing, embedded processing, image processing, and more. It is based on the latest Altera Stratix III FPGA technology, and requires the use of HDL (Hardware Description Language) for programming.
The design intention of the EP3SE260F1517C4L is to provide users with an FPGA that can deliver high performance and flexibility, allowing for the creation of complex designs and applications. The chip model features a wide range of features, including high-speed transceivers, high-speed memory interfaces, high-speed DSP blocks, and more. The EP3SE260F1517C4L is designed to be upgradeable, allowing users to take advantage of new features as they become available.
The EP3SE260F1517C4L is also suitable for advanced communication systems, providing users with the ability to implement high-speed communication protocols. The chip model can be used to create systems that are capable of transmitting and receiving data at high speeds, making it ideal for applications such as wireless communication, data transmission, and more.
The product description of the EP3SE260F1517C4L includes a detailed list of features, as well as detailed design requirements. This includes a list of the components that must be included in the design, as well as the necessary connections and configurations. In addition, the product description also includes information on the performance and power consumption of the chip model.
In order to ensure that designs created with the EP3SE260F1517C4L are successful, it is important to follow the design requirements carefully. This includes ensuring that the components are correctly connected and configured, and that the design is optimized for the best performance. It is also important to consider the power consumption of the chip model, as this will affect the overall performance of the design.
To provide users with a better understanding of the EP3SE260F1517C4L, case studies can be used to demonstrate how the chip model can be used in a variety of applications. These case studies can provide users with an insight into the capabilities of the chip model, as well as the benefits of using it in various applications.
In conclusion, the EP3SE260F1517C4L is a high-performance FPGA that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It is designed to be upgradeable, allowing users to take advantage of new features as they become available. The product description and design requirements must be followed carefully to ensure that the design is successful, and case studies can be used to provide users with a better understanding of the chip model and its capabilities.
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1,248 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $11,137.4546 | $11,137.4546 |
10+ | $11,017.6970 | $110,176.9699 |
100+ | $10,418.9091 | $1,041,890.9112 |
1000+ | $9,820.1212 | $4,910,060.6160 |
10000+ | $8,981.8182 | $8,981,818.2000 |
The price is for reference only, please refer to the actual quotation! |