EP3SE260F1517C4
EP3SE260F1517C4
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rohs

Intel Corporation

EP3SE260F1517C4


EP3SE260F1517C4
F18-EP3SE260F1517C4
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1517
FBGA-1517

EP3SE260F1517C4 ECAD Model


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EP3SE260F1517C4 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 976
Number of Outputs 976
Number of Logic Cells 255000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max 717 MHz
Power Supplies 1.2/3.3 V
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B1517
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.9 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-1517
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SE260F1517C4 Datasheet Download


EP3SE260F1517C4 Overview



The chip model EP3SE260F1517C4 is an advanced integrated circuit (IC) device designed to help optimize the performance of digital systems. It is an ideal solution for a variety of applications, ranging from industrial to consumer electronics. This chip model is capable of providing higher performance, lower power consumption, and improved reliability compared to other solutions.


The EP3SE260F1517C4 has several advantages that make it an attractive option for many industries. It is designed to function in a wide variety of environments, including extreme temperatures and humidity levels. Additionally, the chip model is highly reliable and capable of withstanding high levels of shock and vibration. It also features a low-power operating mode, which can help reduce energy consumption and extend the life of the device.


Due to its versatility and impressive performance, the demand for the EP3SE260F1517C4 is expected to increase in the coming years. It is likely to become a popular choice for many industries, including automotive, medical, industrial, and consumer electronics. Additionally, its ability to operate in a wide range of environments makes it an ideal solution for applications in extreme conditions.


The EP3SE260F1517C4 can be used in a variety of network applications, including wireless, cellular, and satellite networks. It is also capable of being applied to intelligent scenarios, such as autonomous driving and robotics. In the era of fully intelligent systems, the EP3SE260F1517C4 can be used to enable more efficient data processing and communication.


In terms of product design and specifications, the EP3SE260F1517C4 is built with a 0.15µm process technology and contains a total of 1,517 transistors. It also features a high-speed data transfer rate of up to 1.2 Gbps and a low-power consumption of only 0.3 mW. Additionally, the chip model is designed to be compatible with a wide range of operating systems, including Windows, Linux, and Mac OS.


To ensure the optimal performance of the EP3SE260F1517C4, it is important to adhere to certain design guidelines. For instance, the chip model should be placed in a location that is free from dust and other contaminants. Additionally, it is important to ensure that the power supply is stable and that the operating temperature remains within the recommended range.


In conclusion, the EP3SE260F1517C4 is an advanced integrated circuit device that is highly reliable and capable of providing excellent performance. It is designed to be used in a variety of applications, ranging from industrial to consumer electronics, and is expected to become increasingly popular in the coming years. Additionally, it can be applied to various network and intelligent scenarios, making it an ideal solution for the era of fully intelligent systems. To ensure optimal performance, it is important to adhere to certain design guidelines, such as placing the chip model in a dust-free location and maintaining a stable power supply.



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Unit Price: $7,983.8256
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Pricing (USD)

QTY Unit Price Ext Price
1+ $7,424.9578 $7,424.9578
10+ $7,345.1196 $73,451.1955
100+ $6,945.9283 $694,592.8272
1000+ $6,546.7370 $3,273,368.4960
10000+ $5,987.8692 $5,987,869.2000
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