Intel Corporation
EP3SE260F1517C2N
EP3SE260F1517C2N ECAD Model
EP3SE260F1517C2N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 976 | |
| Number of Outputs | 976 | |
| Number of Logic Cells | 255000 | |
| Number of CLBs | 10200 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 10200 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-1517 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE260F1517C2N Datasheet Download
EP3SE260F1517C2N Overview
The EP3SE260F1517C2N chip model is a powerful tool that can be used in a variety of industries. It is designed to provide a comprehensive solution for high-performance computing and communication applications. This chip model is capable of providing high performance and low power consumption, making it a great choice for a wide range of applications.
The EP3SE260F1517C2N chip model offers a wide range of features that make it ideal for a variety of industries. It features a high-performance processor and a variety of communication interfaces, including Ethernet, USB, and PCI Express. It also supports both 2D and 3D graphics and is capable of handling high-bandwidth data streams. This chip model is also capable of providing high-speed data transmission and low-power consumption.
The EP3SE260F1517C2N chip model is expected to be in high demand in the future, as it can provide a comprehensive solution for a variety of industries. Its wide range of features makes it ideal for applications in the automotive, medical, and industrial sectors. It can also be used in the communications industry, as it is capable of providing high-speed data transmission and low-power consumption.
The original design intention of the EP3SE260F1517C2N chip model was to provide a comprehensive solution for high-performance computing and communication applications. It was designed to provide a high-performance processor and a variety of communication interfaces, as well as support for both 2D and 3D graphics. It is also capable of providing high-speed data transmission and low-power consumption.
The EP3SE260F1517C2N chip model is capable of being upgraded in the future. It can be upgraded to support new technologies and applications, making it a great choice for a wide range of industries. It is also capable of being used in the era of fully intelligent systems, as it is capable of providing high-speed data transmission and low-power consumption.
The EP3SE260F1517C2N chip model can be applied to a variety of networks and intelligent scenarios. It can be used in the automotive industry, as it is capable of providing high-speed data transmission and low-power consumption. It can also be used in medical and industrial applications, as it is capable of providing a comprehensive solution for high-performance computing and communication applications. It can also be used in the communications industry, as it is capable of providing high-speed data transmission and low-power consumption.
The EP3SE260F1517C2N chip model is a powerful tool that can be used in a variety of industries. It is designed to provide a comprehensive solution for high-performance computing and communication applications. It is capable of providing high performance and low power consumption, making it a great choice for a wide range of applications. It is expected to be in high demand in the future, as it can provide a comprehensive solution for a variety of industries. It can also be upgraded to support new technologies and applications, making it a great choice for a wide range of industries. It can be applied to a variety of networks and intelligent scenarios, making it a great choice for a wide range of applications in the automotive, medical, and industrial sectors. It can also be used in the era of fully intelligent systems, as it is capable of providing high-speed data transmission and low-power consumption.
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3,048 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $11,407.4142 | $11,407.4142 |
| 10+ | $11,284.7539 | $112,847.5386 |
| 100+ | $10,671.4520 | $1,067,145.2016 |
| 1000+ | $10,058.1502 | $5,029,075.0880 |
| 10000+ | $9,199.5276 | $9,199,527.6000 |
| The price is for reference only, please refer to the actual quotation! | ||