EP3SE260F1517C2
EP3SE260F1517C2
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rohs

Intel Corporation

EP3SE260F1517C2


EP3SE260F1517C2
F18-EP3SE260F1517C2
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1517
FBGA-1517

EP3SE260F1517C2 ECAD Model


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EP3SE260F1517C2 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 976
Number of Outputs 976
Number of Logic Cells 255000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max 800 MHz
Power Supplies 1.2/3.3 V
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B1517
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.9 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-1517
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SE260F1517C2 Datasheet Download


EP3SE260F1517C2 Overview



The chip model EP3SE260F1517C2 is a powerful, programmable logic device that is designed for use in a variety of applications. It is a high-performance, low-power, and cost-effective solution for a wide range of applications. This chip model is designed to work with a variety of operating systems, including Windows, Linux, and Android. It has a wide range of features and functions, including a high-speed, multi-core processor, an advanced memory controller, and an integrated I/O controller.


The chip model EP3SE260F1517C2 is becoming increasingly popular in the industry due to its features and performance. It is being used in a variety of applications, including industrial automation, medical devices, and consumer electronics. The chip model is also being used in the development of intelligent robots, as it provides the necessary computing power, memory, and I/O capabilities to enable the development of sophisticated robotic systems.


The industry trends of the chip model EP3SE260F1517C2 are expected to remain strong in the future. As the demand for intelligent robots increases, the need for powerful and cost-effective solutions such as the EP3SE260F1517C2 will also increase. As a result, the demand for the chip model will continue to grow in the future.


In terms of the application environment, the chip model EP3SE260F1517C2 can be used to develop and popularize future intelligent robots. However, it is important to note that in order to use the chip model effectively, the application environment must be supported by the latest technologies. This includes the use of artificial intelligence, machine learning, and robotics. In addition, the application environment must also have the necessary computing power, memory, and I/O capabilities to enable the development of sophisticated robotic systems.


In terms of the technical talents needed to use the chip model EP3SE260F1517C2 effectively, it is important to note that the application environment must be supported by the latest technologies. This includes the use of artificial intelligence, machine learning, and robotics. In addition, the application environment must also have the necessary computing power, memory, and I/O capabilities to enable the development of sophisticated robotic systems. The technical talents needed to use the chip model effectively include software engineers, computer scientists, and robotics engineers.


In conclusion, the chip model EP3SE260F1517C2 is becoming increasingly popular in the industry due to its features and performance. It is being used in a variety of applications, including industrial automation, medical devices, and consumer electronics. The industry trends of the chip model EP3SE260F1517C2 are expected to remain strong in the future, and it can be used to develop and popularize future intelligent robots. In order to use the chip model effectively, the application environment must be supported by the latest technologies, and the technical talents needed to use the chip model effectively include software engineers, computer scientists, and robotics engineers.



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Unit Price: $13,492.6344
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Pricing (USD)

QTY Unit Price Ext Price
1+ $12,548.1500 $12,548.1500
10+ $12,413.2236 $124,132.2365
100+ $11,738.5919 $1,173,859.1928
1000+ $11,063.9602 $5,531,980.1040
10000+ $10,119.4758 $10,119,475.8000
The price is for reference only, please refer to the actual quotation!

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