Intel Corporation
EP3SE260F1152I4LG
EP3SE260F1152I4LG ECAD Model
EP3SE260F1152I4LG Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Logic Cells | 255000 | |
| Number of CLBs | 10200 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 10200 CLBS | |
| Additional Feature | ALSO OPERATES AT 1.1V VCC NOMINAL | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.6 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE260F1152I4LG Datasheet Download
EP3SE260F1152I4LG Overview
The EP3SE260F1152I4LG chip model is an advanced programmable logic device (PLD) that was developed by Altera Corporation. It is a high-performance device that combines the features of a field-programmable gate array (FPGA) and a microcontroller, enabling it to provide users with a wide range of capabilities.
The EP3SE260F1152I4LG chip model was designed to meet the needs of a variety of applications. It is a cost-effective solution that can be used in a wide range of applications such as communications, industrial automation, and consumer electronics. The device has the ability to be upgraded with new features and capabilities, allowing users to stay up to date with the latest technology.
The EP3SE260F1152I4LG chip model can be used for advanced communication systems, such as 4G/5G cellular networks and Wi-Fi networks. It can be used to develop and deploy applications such as Internet of Things (IoT) networks, machine-to-machine communications, and sensor networks. The device can also be used for intelligent scenarios such as facial recognition, voice recognition, and natural language processing.
The EP3SE260F1152I4LG chip model can be used in the development and popularization of future intelligent robots. This device is ideal for robotic applications due to its low power consumption, flexibility, and scalability. Furthermore, the device is programmable, allowing users to customize the features and performance of the robot.
In order to use the EP3SE260F1152I4LG chip model effectively, users need to have a strong understanding of digital logic, programming languages, and embedded systems. Furthermore, users should have a good understanding of the device’s architecture and the development tools available for it. With the right knowledge and skills, users can develop and deploy applications that can take advantage of the device’s capabilities.
In conclusion, the EP3SE260F1152I4LG chip model is a powerful and versatile device that can be used for a wide range of applications. It is a cost-effective solution that can be used for advanced communication systems, intelligent scenarios, and robotic applications. Furthermore, users need to have the right knowledge and skills in order to use the device effectively.
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1,626 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $67,002.6072 | $67,002.6072 |
| 10+ | $66,282.1491 | $662,821.4906 |
| 100+ | $62,679.8584 | $6,267,985.8354 |
| 1000+ | $59,077.5676 | $29,538,783.8220 |
| 10000+ | $54,034.3607 | $54,034,360.6500 |
| The price is for reference only, please refer to the actual quotation! | ||