Intel Corporation
EP3SE260F1152I4G
EP3SE260F1152I4G ECAD Model
EP3SE260F1152I4G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 255000 | |
| Number of CLBs | 10200 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 10200 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.55 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE260F1152I4G Datasheet Download
EP3SE260F1152I4G Overview
The chip model EP3SE260F1152I4G is a highly advanced and sophisticated chip model that has been developed to support the latest technologies and applications in the industry. It is a powerful integrated circuit that combines the latest technologies and features in order to provide the highest performance and reliability. The chip model is designed to support the most advanced communication systems, such as 5G, Wi-Fi 6, and 4G LTE. It also supports a wide range of applications, such as artificial intelligence, machine learning, and robotics.
Regarding the industry trends of the chip model EP3SE260F1152I4G and the future development of related industries, it is expected that the chip model will continue to evolve and become more powerful in order to meet the increasing demands of the industry. This will require the development of new technologies, such as quantum computing and blockchain, as well as the integration of existing technologies in order to create a more powerful and efficient chip model.
The original design intention of the chip model EP3SE260F1152I4G was to provide the highest performance and reliability in order to meet the needs of the most advanced communication systems. In addition, the chip model is also designed to be highly scalable, allowing it to be used in a wide range of applications. This makes it an ideal choice for the development and popularization of future intelligent robots.
In order to use the chip model EP3SE260F1152I4G effectively, it is necessary to have a good understanding of the latest technologies and their applications. This requires highly skilled technical talents, such as engineers and software developers, who are knowledgeable in the latest technologies and their applications. Furthermore, it is also important to have a good understanding of the chip model's design and architecture in order to make the most of its features and capabilities.
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5,277 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $51,509.8045 | $51,509.8045 |
| 10+ | $50,955.9357 | $509,559.3567 |
| 100+ | $48,186.5913 | $4,818,659.1342 |
| 1000+ | $45,417.2470 | $22,708,623.5060 |
| 10000+ | $41,540.1650 | $41,540,164.9500 |
| The price is for reference only, please refer to the actual quotation! | ||