Intel Corporation
EP3SE260F1152I3G
EP3SE260F1152I3G ECAD Model
EP3SE260F1152I3G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 255000 | |
| Number of CLBs | 10200 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 10200 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.55 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE260F1152I3G Datasheet Download
EP3SE260F1152I3G Overview
The chip model EP3SE260F1152I3G is a high-performance, low-power FPGA from Altera, and is widely used in various application fields. With the rapid development of technology, the chip model EP3SE260F1152I3G is increasingly being used in more and more application scenarios.
Industry trends for the chip model EP3SE260F1152I3G are positive. It is being used in various industries, including industrial automation, automotive, aerospace, medical, and consumer electronics. As the demand for intelligent systems grows, the chip model EP3SE260F1152I3G is expected to be used in more and more applications. It is capable of providing high performance and low power consumption, making it an ideal choice for intelligent systems.
The chip model EP3SE260F1152I3G is also suitable for use in networks. It can be used to build high-speed, low-power, and secure networks. It is also suitable for use in intelligent scenarios, such as machine learning, artificial intelligence, and natural language processing. The chip model EP3SE260F1152I3G is also capable of providing the necessary support for the development of fully intelligent systems.
In conclusion, the chip model EP3SE260F1152I3G is an ideal choice for various industries and application scenarios. It is capable of providing high performance and low power consumption, making it a popular choice for intelligent systems. It is also suitable for use in networks and intelligent scenarios, and can provide the necessary support for the development of fully intelligent systems. As such, the chip model EP3SE260F1152I3G is expected to be in high demand in the future.
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3,721 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $66,997.9920 | $66,997.9920 |
| 10+ | $66,277.5835 | $662,775.8347 |
| 100+ | $62,675.5409 | $6,267,554.0892 |
| 1000+ | $59,073.4983 | $29,536,749.1560 |
| 10000+ | $54,030.6387 | $54,030,638.7000 |
| The price is for reference only, please refer to the actual quotation! | ||