
Intel Corporation
EP3SE260F1152C4LN
EP3SE260F1152C4LN ECAD Model
EP3SE260F1152C4LN Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 744 | |
Number of Outputs | 744 | |
Number of Logic Cells | 255000 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Clock Frequency-Max | 717 MHz | |
Power Supplies | 1.2/3.3 V | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.9 mm | |
Ihs Manufacturer | ALTERA CORP | |
Package Description | BGA, BGA1152,34X34,40 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Pin Count | 1152 |
EP3SE260F1152C4LN Overview
The chip model EP3SE260F1152C4LN is a high-performance, low-power, multi-core processor that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed with the HDL language, which allows for the development of complex systems with a high degree of flexibility.
The original design intention of the chip model EP3SE260F1152C4LN was to provide a powerful and efficient solution for digital signal processing, embedded processing, and image processing applications. It is designed to be able to handle a wide range of tasks, from simple calculations to complex algorithms. It has the capability to be upgraded in the future, allowing for even more powerful performance.
The chip model EP3SE260F1152C4LN is also suitable for advanced communication systems. It provides a high level of performance, while still maintaining low power consumption. Its flexibility allows for the development of a wide range of applications. It is designed to be able to handle a variety of communication protocols, such as Ethernet, USB, and Bluetooth.
The product description of the chip model EP3SE260F1152C4LN includes its features, specifications, and design requirements. It is designed to be able to handle a variety of tasks, from simple calculations to complex algorithms. It is designed to be able to handle a wide range of communication protocols, such as Ethernet, USB, and Bluetooth. It is designed to be able to handle a variety of tasks, from simple calculations to complex algorithms. It is also designed to be able to handle a wide range of tasks, from simple calculations to complex algorithms.
In order to ensure the best performance of the chip model EP3SE260F1152C4LN, there are a few precautions to be taken into consideration. It is important to ensure that the chip is correctly installed and configured. It is also important to ensure that the chip is correctly powered and that the necessary cooling measures are taken. Additionally, the chip should be regularly tested to ensure that it is functioning correctly.
The chip model EP3SE260F1152C4LN has been used in a variety of applications, from high-performance digital signal processing to embedded processing. A case study of the chip was conducted by a team of engineers from a leading electronics company. The team found that the chip was able to provide a high level of performance, while still maintaining low power consumption. The chip was also able to handle a variety of communication protocols, such as Ethernet, USB, and Bluetooth.
The chip model EP3SE260F1152C4LN is a powerful and efficient solution for digital signal processing, embedded processing, and image processing applications. It is designed with the HDL language, which allows for the development of complex systems with a high degree of flexibility. Its flexibility allows for the development of a wide range of applications. It is also suitable for advanced communication systems, providing a high level of performance, while still maintaining low power consumption. In order to ensure the best performance of the chip, it is important to ensure that it is correctly installed and configured, that it is correctly powered, and that the necessary cooling measures are taken. Additionally, the chip should be regularly tested to ensure that it is functioning correctly.
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2,660 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $9,985.4189 | $9,985.4189 |
10+ | $9,878.0488 | $98,780.4883 |
100+ | $9,341.1984 | $934,119.8352 |
1000+ | $8,804.3479 | $4,402,173.9360 |
10000+ | $8,052.7572 | $8,052,757.2000 |
The price is for reference only, please refer to the actual quotation! |