EP3SE260F1152C4LN
EP3SE260F1152C4LN
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rohs

Intel Corporation

EP3SE260F1152C4LN


EP3SE260F1152C4LN
F18-EP3SE260F1152C4LN
Active
IC FPGA 744 I/O 1152FBGA
1152-FBGA (35x35)

EP3SE260F1152C4LN ECAD Model


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EP3SE260F1152C4LN Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 900 mV
Number of Inputs 744
Number of Outputs 744
Number of Logic Cells 255000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max 717 MHz
Power Supplies 1.2/3.3 V
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.9 mm
Ihs Manufacturer ALTERA CORP
Package Description BGA, BGA1152,34X34,40
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Pin Count 1152

EP3SE260F1152C4LN Overview



The chip model EP3SE260F1152C4LN is a high-performance, low-power, multi-core processor that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed with the HDL language, which allows for the development of complex systems with a high degree of flexibility.


The original design intention of the chip model EP3SE260F1152C4LN was to provide a powerful and efficient solution for digital signal processing, embedded processing, and image processing applications. It is designed to be able to handle a wide range of tasks, from simple calculations to complex algorithms. It has the capability to be upgraded in the future, allowing for even more powerful performance.


The chip model EP3SE260F1152C4LN is also suitable for advanced communication systems. It provides a high level of performance, while still maintaining low power consumption. Its flexibility allows for the development of a wide range of applications. It is designed to be able to handle a variety of communication protocols, such as Ethernet, USB, and Bluetooth.


The product description of the chip model EP3SE260F1152C4LN includes its features, specifications, and design requirements. It is designed to be able to handle a variety of tasks, from simple calculations to complex algorithms. It is designed to be able to handle a wide range of communication protocols, such as Ethernet, USB, and Bluetooth. It is designed to be able to handle a variety of tasks, from simple calculations to complex algorithms. It is also designed to be able to handle a wide range of tasks, from simple calculations to complex algorithms.


In order to ensure the best performance of the chip model EP3SE260F1152C4LN, there are a few precautions to be taken into consideration. It is important to ensure that the chip is correctly installed and configured. It is also important to ensure that the chip is correctly powered and that the necessary cooling measures are taken. Additionally, the chip should be regularly tested to ensure that it is functioning correctly.


The chip model EP3SE260F1152C4LN has been used in a variety of applications, from high-performance digital signal processing to embedded processing. A case study of the chip was conducted by a team of engineers from a leading electronics company. The team found that the chip was able to provide a high level of performance, while still maintaining low power consumption. The chip was also able to handle a variety of communication protocols, such as Ethernet, USB, and Bluetooth.


The chip model EP3SE260F1152C4LN is a powerful and efficient solution for digital signal processing, embedded processing, and image processing applications. It is designed with the HDL language, which allows for the development of complex systems with a high degree of flexibility. Its flexibility allows for the development of a wide range of applications. It is also suitable for advanced communication systems, providing a high level of performance, while still maintaining low power consumption. In order to ensure the best performance of the chip, it is important to ensure that it is correctly installed and configured, that it is correctly powered, and that the necessary cooling measures are taken. Additionally, the chip should be regularly tested to ensure that it is functioning correctly.



2,660 In Stock


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Unit Price: $10,737.0096
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $9,985.4189 $9,985.4189
10+ $9,878.0488 $98,780.4883
100+ $9,341.1984 $934,119.8352
1000+ $8,804.3479 $4,402,173.9360
10000+ $8,052.7572 $8,052,757.2000
The price is for reference only, please refer to the actual quotation!

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