Intel Corporation
EP3SE260F1152C4LG
EP3SE260F1152C4LG ECAD Model
EP3SE260F1152C4LG Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Logic Cells | 255000 | |
| Number of CLBs | 10200 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 10200 CLBS | |
| Additional Feature | ALSO OPERATES AT 1.1V VCC NOMINAL | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.6 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE260F1152C4LG Datasheet Download
EP3SE260F1152C4LG Overview
The chip model EP3SE260F1152C4LG is a high-performance digital signal processor that is suitable for a variety of applications, including embedded processing, image processing, and more. It is designed to be used with a HDL language and is capable of providing high-speed data processing.
The EP3SE260F1152C4LG is a powerful chip that is capable of handling large amounts of data quickly and efficiently. It is designed to be used in a variety of applications and can be used for high-performance digital signal processing, embedded processing, image processing, and more. The chip is also capable of supporting new technologies, making it a viable option for advanced communication systems.
The original design intention of the EP3SE260F1152C4LG was to provide users with a powerful and reliable processor that could handle large amounts of data quickly and efficiently. It was designed to be used in a variety of application scenarios and is capable of supporting new technologies. The chip is also capable of being upgraded in the future, allowing users to take advantage of new technologies and features as they become available.
The industry trends of the EP3SE260F1152C4LG and the future development of related industries will depend on what specific technologies are needed. The chip is capable of supporting the latest technologies and can be used in a variety of applications, making it a great choice for advanced communication systems. The chip is capable of being upgraded in the future, allowing users to take advantage of new technologies and features as they become available.
In conclusion, the EP3SE260F1152C4LG is a powerful and reliable processor that is capable of handling large amounts of data quickly and efficiently. It is designed to be used in a variety of application scenarios and is capable of supporting new technologies. The chip is also capable of being upgraded in the future, allowing users to take advantage of new technologies and features as they become available. The industry trends of the EP3SE260F1152C4LG and the future development of related industries will depend on what specific technologies are needed.
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4,591 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $59,436.8071 | $59,436.8071 |
| 10+ | $58,797.7017 | $587,977.0168 |
| 100+ | $55,602.1744 | $5,560,217.4411 |
| 1000+ | $52,406.6471 | $26,203,323.5730 |
| 10000+ | $47,932.9090 | $47,932,908.9750 |
| The price is for reference only, please refer to the actual quotation! | ||