Intel Corporation
EP3SE260F1152C4
EP3SE260F1152C4 ECAD Model
EP3SE260F1152C4 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 255000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.9 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE260F1152C4 Datasheet Download
EP3SE260F1152C4 Overview
The EP3SE260F1152C4 chip model is a highly advanced and sophisticated product, designed to meet the needs of a variety of industries. This model is based on the latest technology, allowing it to provide a range of features and benefits. It is also designed to be easily upgradable, so that it can keep up with the ever-changing needs of the industry.
The EP3SE260F1152C4 chip model is designed to provide an efficient and reliable solution for a range of applications. It is designed to provide a high level of performance, with the ability to handle complex tasks with ease. It is also designed to be highly reliable, ensuring that it can be used for a long period of time without any issues.
The EP3SE260F1152C4 chip model is designed to be used in a variety of industries, including telecommunications, medical, automotive, and consumer electronics. This chip model is expected to be in high demand in the near future, as it is designed to provide a reliable and efficient solution for a range of applications. It is also expected to be a popular choice for advanced communication systems, as it is designed to provide a reliable connection between users and devices.
The EP3SE260F1152C4 chip model is designed to meet a variety of specific design requirements. It is designed to be highly reliable, with the ability to handle a wide range of tasks. It is also designed to be highly efficient, allowing it to provide a high level of performance. Additionally, it is designed to be easily upgradable, so that it can keep up with the ever-changing needs of the industry.
In order to ensure that the EP3SE260F1152C4 chip model is used correctly, it is important to understand the design requirements and the specific features of the product. This will ensure that the chip model is used correctly and that it is able to provide the desired performance. Additionally, it is important to understand how the chip model will interact with other components in the system, so that the desired results can be achieved.
Case studies have been conducted to demonstrate the effectiveness of the EP3SE260F1152C4 chip model. These studies have shown that the chip model is highly reliable and efficient, and that it is able to provide a high level of performance. Additionally, the studies have shown that the chip model is able to provide a reliable connection between users and devices, allowing for a more efficient communication system.
The EP3SE260F1152C4 chip model is a highly advanced and sophisticated product, designed to meet the needs of a variety of industries. It is designed to provide a reliable and efficient solution for a range of applications, and is expected to be in high demand in the near future. It is also designed to be easily upgradable, so that it can keep up with the ever-changing needs of the industry. In order to ensure that the EP3SE260F1152C4 chip model is used correctly, it is important to understand the design requirements and the specific features of the product. Additionally, case studies have been conducted to demonstrate the effectiveness of the chip model, showing that it is able to provide a reliable connection between users and devices.
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5,665 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $7,322.6407 | $7,322.6407 |
| 10+ | $7,243.9026 | $72,439.0262 |
| 100+ | $6,850.2123 | $685,021.2264 |
| 1000+ | $6,456.5219 | $3,228,260.9520 |
| 10000+ | $5,905.3554 | $5,905,355.4000 |
| The price is for reference only, please refer to the actual quotation! | ||