Intel Corporation
EP3SE260F1152C3G
EP3SE260F1152C3G ECAD Model
EP3SE260F1152C3G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 255000 | |
| Number of CLBs | 10200 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 10200 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.55 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE260F1152C3G Datasheet Download
EP3SE260F1152C3G Overview
The chip model EP3SE260F1152C3G is a highly efficient and reliable chip model for commercial and industrial applications. It is designed to provide high-speed, low-power, and highly-reliable performance for embedded systems and communication applications. This chip model has a wide range of features that make it suitable for a variety of applications.
The main advantages of the EP3SE260F1152C3G chip model include its low power consumption, high speed, and low cost. This makes it suitable for use in a variety of applications such as industrial and commercial applications. It also has excellent signal-to-noise ratio, which makes it suitable for use in a variety of communication systems. The chip model also offers a wide range of options for customization, allowing for a wide range of applications.
The EP3SE260F1152C3G chip model is expected to have a growing demand in the future as more applications are developed for it. It is expected to be used in more advanced communication systems and networks, as well as in intelligent scenarios. It is also expected to be used in the era of fully intelligent systems as it is capable of providing high-speed, low-power, and highly-reliable performance.
The original design intention of the EP3SE260F1152C3G chip model was to provide high-speed, low-power, and highly-reliable performance for embedded systems and communication applications. This chip model can be further upgraded to meet the demands of advanced communication systems and networks, as well as for intelligent scenarios. It is also possible to use the chip model in the era of fully intelligent systems, as it is capable of providing high-speed, low-power, and highly-reliable performance.
The EP3SE260F1152C3G chip model is expected to be used in a variety of applications in the future, including in networks and intelligent scenarios. It is expected to be used in the era of fully intelligent systems as it is capable of providing high-speed, low-power, and highly-reliable performance. It is also expected to be used in a variety of communication systems and networks, as well as in intelligent scenarios.
In conclusion, the EP3SE260F1152C3G chip model is a highly efficient and reliable chip model for commercial and industrial applications. Its main advantages include its low power consumption, high speed, and low cost. It is expected to have a growing demand in the future as more applications are developed for it. It is also expected to be used in more advanced communication systems and networks, as well as in intelligent scenarios. It is also possible to use the chip model in the era of fully intelligent systems, as it is capable of providing high-speed, low-power, and highly-reliable performance.
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2,462 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $51,531.0916 | $51,531.0916 |
| 10+ | $50,976.9938 | $509,769.9383 |
| 100+ | $48,206.5050 | $4,820,650.5033 |
| 1000+ | $45,436.0162 | $22,718,008.1190 |
| 10000+ | $41,557.3319 | $41,557,331.9250 |
| The price is for reference only, please refer to the actual quotation! | ||