Intel Corporation
EP3SE260F1152C3
EP3SE260F1152C3 ECAD Model
EP3SE260F1152C3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 255000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.9 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE260F1152C3 Datasheet Download
EP3SE260F1152C3 Overview
The chip model EP3SE260F1152C3 is a highly advanced integrated circuit that is designed for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language that is used to define the behavior of digital circuits. This chip model is capable of providing high-speed, low-power performance, making it ideal for a variety of applications.
The EP3SE260F1152C3 is an advanced chip model that is designed to meet the needs of the modern industry. It is capable of providing high-performance digital signal processing, embedded processing, and image processing, making it suitable for a variety of applications. It is also designed to be used with the HDL language, which is the standard language used to define the behavior of digital circuits.
The EP3SE260F1152C3 is a powerful chip model that has many advantages over other chip models. It is capable of providing high-speed, low-power performance, making it suitable for a variety of applications. It also offers a wide range of features, including advanced signal processing, image processing, and embedded processing. Additionally, it is designed to be used with the HDL language, which is the standard language used to define the behavior of digital circuits.
The EP3SE260F1152C3 is a powerful chip model that is designed to meet the needs of the modern industry. It is expected to be in high demand in the future due to its high-speed, low-power performance and its wide range of features. Additionally, its use of the HDL language makes it suitable for a variety of applications. As the industry continues to evolve and new technologies are developed, the EP3SE260F1152C3 is expected to remain in high demand due to its advanced features and capabilities.
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4,454 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $9,519.0410 | $9,519.0410 |
| 10+ | $9,416.6858 | $94,166.8576 |
| 100+ | $8,904.9094 | $890,490.9360 |
| 1000+ | $8,393.1330 | $4,196,566.4800 |
| 10000+ | $7,676.6460 | $7,676,646.0000 |
| The price is for reference only, please refer to the actual quotation! | ||