Intel Corporation
EP3SE260F1152C2N
EP3SE260F1152C2N ECAD Model
EP3SE260F1152C2N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 255000 | |
| Number of CLBs | 10200 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 10200 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.6 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE260F1152C2N Datasheet Download
EP3SE260F1152C2N Overview
The chip model EP3SE260F1152C2N is an advanced programmable logic device (PLD) designed to provide high density and low power consumption for various applications. It is a powerful and versatile device that can be used to implement complex logic functions. The original design intention of the chip model EP3SE260F1152C2N is to enable the implementation of complex logic functions in a cost-effective and energy-efficient manner.
The chip model EP3SE260F1152C2N has the potential to be upgraded in the future to meet the needs of advanced communication systems. It has the capability to support high-speed communication protocols such as Ethernet, CANbus, and USB. It also has the ability to process data quickly and accurately, making it suitable for use in advanced networks. In addition, the chip model EP3SE260F1152C2N can be used in intelligent scenarios such as machine learning, natural language processing, and robotics.
The chip model EP3SE260F1152C2N can be used to develop and popularize future intelligent robots. It is capable of supporting a wide range of robotic applications such as navigation, object recognition, and motion control. The chip model EP3SE260F1152C2N also has the ability to process data quickly and accurately, making it suitable for use in robotic applications. To use the chip model EP3SE260F1152C2N effectively, one must have the technical skills to program the device and understand the fundamentals of robotics.
In conclusion, the chip model EP3SE260F1152C2N is a powerful and versatile PLD that can be used to implement complex logic functions in a cost-effective and energy-efficient manner. It has the potential to be upgraded in the future to meet the needs of advanced communication systems, and can be used in intelligent scenarios such as machine learning, natural language processing, and robotics. The chip model EP3SE260F1152C2N can also be used to develop and popularize future intelligent robots. To use the chip model EP3SE260F1152C2N effectively, one must have the technical skills to program the device and understand the fundamentals of robotics.
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4,498 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $11,250.2822 | $11,250.2822 |
| 10+ | $11,129.3114 | $111,293.1139 |
| 100+ | $10,524.4575 | $1,052,445.7512 |
| 1000+ | $9,919.6036 | $4,959,801.8160 |
| 10000+ | $9,072.8082 | $9,072,808.2000 |
| The price is for reference only, please refer to the actual quotation! | ||