Intel Corporation
EP3SE260F1152C2G
EP3SE260F1152C2G ECAD Model
EP3SE260F1152C2G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 255000 | |
| Number of CLBs | 10200 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 10200 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.55 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE260F1152C2G Datasheet Download
EP3SE260F1152C2G Overview
The chip model EP3SE260F1152C2G is a powerful and versatile digital signal processor (DSP) designed for high-performance embedded processing, digital signal processing, image processing, and other applications. It is capable of performing complex tasks with a high level of accuracy, and it requires the use of HDL language to program it.
The chip model EP3SE260F1152C2G is designed to provide users with the flexibility to develop applications tailored to their specific needs. It can be used in a wide range of industries, such as telecommunications, automotive, medical, and consumer electronics. With its wide range of applications, it is expected to become increasingly popular in the near future.
The chip model EP3SE260F1152C2G offers several advantages over other DSPs. It is capable of performing complex tasks quickly and accurately, and it is also highly energy efficient. Additionally, it is relatively easy to program, making it suitable for a wide range of users.
In terms of industry trends, the chip model EP3SE260F1152C2G is expected to become increasingly popular in the near future, as more and more applications require the use of digital signal processing and embedded processing. Additionally, the chip model is expected to benefit from the development of new technologies, such as artificial intelligence and machine learning, which are becoming increasingly important in the world of digital signal processing.
Overall, the chip model EP3SE260F1152C2G is an excellent choice for high-performance digital signal processing, embedded processing, and image processing. It is capable of performing complex tasks quickly and accurately, and it is also highly energy efficient. Additionally, it is relatively easy to program, making it suitable for a wide range of users. As more and more applications require the use of digital signal processing and embedded processing, the chip model is expected to become increasingly popular in the near future.
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5,749 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $20,250.3706 | $20,250.3706 |
| 10+ | $20,032.6246 | $200,326.2464 |
| 100+ | $18,943.8950 | $1,894,389.5040 |
| 1000+ | $17,855.1654 | $8,927,582.7200 |
| 10000+ | $16,330.9440 | $16,330,944.0000 |
| The price is for reference only, please refer to the actual quotation! | ||