Intel Corporation
EP3SE110F780I4G
EP3SE110F780I4G ECAD Model
EP3SE110F780I4G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 107500 | |
| Number of CLBs | 4300 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 4300 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE110F780I4G Datasheet Download
EP3SE110F780I4G Overview
The chip model EP3SE110F780I4G is a powerful and innovative product from Altera Corporation that has been designed to meet the various needs of modern communications systems. This model is based on a field-programmable gate array (FPGA) architecture and is capable of handling a wide range of tasks, from basic data processing to advanced applications.
The original design intention of the chip model EP3SE110F780I4G was to provide a reliable, high-performance solution for communications systems. It is capable of providing high-speed data processing and can be used to build complex networks with multiple nodes. The model also features a range of features designed to optimize performance, such as dynamic partial reconfiguration, which allows for efficient data processing.
The chip model EP3SE110F780I4G is also capable of being upgraded in the future, making it an ideal choice for those looking to stay ahead of the curve in terms of technology. With its advanced features, it can easily be adapted to meet the needs of more complex networks, such as those used in the Internet of Things (IoT) or 5G networks. Additionally, its ability to support advanced communication protocols and its ability to be used in distributed computing architectures make it a great choice for many applications.
The chip model EP3SE110F780I4G can also be applied to the development and popularization of future intelligent robots. Its high-speed data processing capabilities and its ability to support advanced communication protocols make it an ideal choice for those looking to build intelligent robots. Additionally, its support for distributed computing architectures makes it a great choice for those looking to build robots that can interact with each other.
In order to effectively use the chip model EP3SE110F780I4G, technical talents such as software engineers, hardware engineers, and system architects are needed. These individuals should have a strong understanding of the FPGA architecture, as well as the various protocols and technologies used in modern communications systems. Additionally, they should have a good understanding of the various programming languages used to develop intelligent robots.
In conclusion, the chip model EP3SE110F780I4G is a powerful and reliable solution for communications systems. It is capable of providing high-speed data processing and can be used to build complex networks with multiple nodes. It is also capable of being upgraded in the future, making it an ideal choice for those looking to stay ahead of the curve in terms of technology. Additionally, its ability to support advanced communication protocols and its ability to be used in distributed computing architectures make it a great choice for many applications, including the development and popularization of future intelligent robots. Technical talents such as software engineers, hardware engineers, and system architects are needed to effectively use the chip model EP3SE110F780I4G.
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4,475 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $15,918.8543 | $15,918.8543 |
| 10+ | $15,747.6838 | $157,476.8379 |
| 100+ | $14,891.8314 | $1,489,183.1412 |
| 1000+ | $14,035.9790 | $7,017,989.5160 |
| 10000+ | $12,837.7857 | $12,837,785.7000 |
| The price is for reference only, please refer to the actual quotation! | ||