Intel Corporation
EP3SE110F780C3G
EP3SE110F780C3G ECAD Model
EP3SE110F780C3G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 107500 | |
| Number of CLBs | 4300 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 4300 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE110F780C3G Datasheet Download
EP3SE110F780C3G Overview
The chip model EP3SE110F780C3G is a powerful and versatile integrated circuit designed for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other related tasks. The chip model’s original design intention was to provide users with a cost-effective solution for their needs. Furthermore, the chip model offers the possibility of future upgrades, allowing users to customize their system’s performance as their needs evolve.
The chip model EP3SE110F780C3G is an excellent choice for advanced communication systems. It is capable of handling a wide range of communication protocols, and its onboard memory can be used to store large amounts of data for quick retrieval. The chip model also has the capability to be used for the development and popularization of future intelligent robots. Its powerful processing capabilities, combined with its ability to handle a variety of communication protocols, make it an ideal choice for these types of applications.
To use the chip model EP3SE110F780C3G effectively, users must have a basic understanding of HDL (Hardware Description Language). This language is used to create digital systems, and it is necessary to design and program the chip model. Additionally, users should have a good understanding of electronics, as well as experience in programming and debugging digital systems. With these skills, users should be able to use the chip model effectively and efficiently.
In conclusion, the chip model EP3SE110F780C3G is a powerful and versatile integrated circuit designed for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other related tasks. It is also an excellent choice for advanced communication systems and the development and popularization of future intelligent robots. To use the chip model effectively, users must have a basic understanding of HDL, as well as experience in programming and debugging digital systems. With these skills, users should be able to use the chip model effectively and efficiently.
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3,151 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $15,922.2588 | $15,922.2588 |
| 10+ | $15,751.0517 | $157,510.5173 |
| 100+ | $14,895.0163 | $1,489,501.6308 |
| 1000+ | $14,038.9809 | $7,019,490.4440 |
| 10000+ | $12,840.5313 | $12,840,531.3000 |
| The price is for reference only, please refer to the actual quotation! | ||