Intel Corporation
EP3SE110F780C3
EP3SE110F780C3 ECAD Model
EP3SE110F780C3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 107500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE110F780C3 Datasheet Download
EP3SE110F780C3 Overview
The chip model EP3SE110F780C3 is a new generation of FPGA chip developed by Altera Corporation. It is designed to meet the needs of high-end communication systems for high-speed signal processing and transmission. It features high-speed signal processing, low power consumption, and high reliability. This chip model has the potential to become a major player in the field of communication systems.
In terms of industry trends, the EP3SE110F780C3 is expected to become increasingly popular in the communication systems market. This chip model can be used in a wide range of applications, including data centers, high-end networks, and intelligent systems. It is also capable of supporting the latest communication protocols and standards, such as the 5G network. Furthermore, its low power consumption makes it an ideal choice for mobile applications.
The EP3SE110F780C3 is also capable of supporting the latest technologies, such as artificial intelligence (AI) and machine learning (ML). This chip model is capable of processing large amounts of data quickly and accurately, making it an ideal choice for applications in the era of fully intelligent systems. Additionally, this chip model can be used in a variety of scenarios, such as autonomous driving, smart home, and industrial automation.
In terms of future upgrades, the EP3SE110F780C3 is expected to be upgraded with the latest technologies. This chip model is capable of supporting the latest communication protocols and standards, such as the 5G network. Additionally, its low power consumption makes it an ideal choice for mobile applications. Furthermore, its high-speed signal processing capabilities make it a suitable choice for applications in the era of fully intelligent systems.
In conclusion, the chip model EP3SE110F780C3 is an advanced FPGA chip developed by Altera Corporation. It has the potential to become a major player in the field of communication systems. It is capable of supporting the latest technologies, such as AI and ML, and can be used in a variety of applications, including data centers, high-end networks, and intelligent systems. Furthermore, this chip model is expected to be upgraded with the latest technologies in the future, making it an ideal choice for applications in the era of fully intelligent systems.
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2,386 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,906.2560 | $2,906.2560 |
| 10+ | $2,875.0059 | $28,750.0589 |
| 100+ | $2,718.7556 | $271,875.5568 |
| 1000+ | $2,562.5052 | $1,281,252.6240 |
| 10000+ | $2,343.7548 | $2,343,754.8000 |
| The price is for reference only, please refer to the actual quotation! | ||