Intel Corporation
EP3SE110F780C2G
EP3SE110F780C2G ECAD Model
EP3SE110F780C2G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 107500 | |
| Number of CLBs | 4300 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 4300 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE110F780C2G Datasheet Download
EP3SE110F780C2G Overview
The chip model EP3SE110F780C2G has been designed with the intention of providing the latest in semiconductor technology for a variety of applications. This chip model is a low-power, high-performance FPGA with a wide range of features and capabilities. The EP3SE110F780C2G supports multiple I/O configurations and offers a wide range of digital signal processing and communication protocols. It is also capable of supporting a variety of high-speed memory interfaces, making it suitable for a variety of applications.
The EP3SE110F780C2G is designed to be used in a variety of industries, including automotive, industrial, medical, and consumer electronics. It is also suitable for use in a variety of communication systems, including wired and wireless networks. The chip model is also capable of supporting the latest in communication technologies, such as 5G, 802.11ac, and Bluetooth 5.0.
The EP3SE110F780C2G is also capable of supporting a variety of intelligent scenarios. It is capable of supporting a variety of AI-based algorithms, such as deep learning, computer vision, and natural language processing. It is also capable of supporting a variety of intelligent applications, such as autonomous driving, robot navigation, and facial recognition.
The chip model EP3SE110F780C2G is designed to be used in the era of fully intelligent systems. It is capable of supporting a variety of advanced communication technologies, such as 5G, 802.11ac, and Bluetooth 5.0. It is also capable of supporting a variety of intelligent applications, such as autonomous driving, robot navigation, and facial recognition. The chip model is also capable of supporting a variety of AI-based algorithms, such as deep learning, computer vision, and natural language processing.
The EP3SE110F780C2G is designed to be upgradable, allowing it to be used in a variety of future applications. It is capable of supporting a variety of new technologies, such as 5G, 802.11ac, and Bluetooth 5.0. It is also capable of supporting a variety of intelligent applications, such as autonomous driving, robot navigation, and facial recognition. The chip model is also capable of supporting a variety of AI-based algorithms, such as deep learning, computer vision, and natural language processing.
The EP3SE110F780C2G is designed to be used in a variety of industries, including automotive, industrial, medical, and consumer electronics. It is also suitable for use in a variety of communication systems, including wired and wireless networks. The chip model is also capable of supporting the latest in communication technologies, such as 5G, 802.11ac, and Bluetooth 5.0. It is also capable of supporting a variety of intelligent scenarios, such as autonomous driving, robot navigation, and facial recognition. The chip model is also capable of supporting a variety of AI-based algorithms, such as deep learning, computer vision, and natural language processing.
The EP3SE110F780C2G is designed to be used in the era of fully intelligent systems. It is capable of supporting a variety of advanced communication technologies, such as 5G, 802.11ac, and Bluetooth 5.0. It is also capable of supporting a variety of intelligent applications, such as autonomous driving, robot navigation, and facial recognition. The chip model is also capable of supporting a variety of AI-based algorithms, such as deep learning, computer vision, and natural language processing.
In conclusion, the chip model EP3SE110F780C2G is designed to be used in a variety of industries, including automotive, industrial, medical, and consumer electronics. It is also suitable for use in a variety of communication systems, including wired and wireless networks. The chip model is also capable of supporting the latest in communication technologies, such as 5G, 802.11ac, and Bluetooth 5.0. It is also capable of supporting a variety of intelligent scenarios, such as autonomous driving, robot navigation, and facial recognition. The chip model is also capable of supporting a variety of AI-based algorithms, such as deep learning, computer vision, and natural language processing. The chip model is designed to be upgradable, allowing it to be used in a variety of future applications and technologies. With its wide range of features and capabilities, the EP3SE110F780C2G is an ideal choice for a variety of applications and industries.
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5,383 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $20,700.1442 | $20,700.1442 |
| 10+ | $20,477.5620 | $204,775.6203 |
| 100+ | $19,364.6511 | $1,936,465.1052 |
| 1000+ | $18,251.7401 | $9,125,870.0360 |
| 10000+ | $16,693.6647 | $16,693,664.7000 |
| The price is for reference only, please refer to the actual quotation! | ||