Intel Corporation
EP3SE110F1152I4LG
EP3SE110F1152I4LG ECAD Model
EP3SE110F1152I4LG Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Logic Cells | 107500 | |
| Number of CLBs | 4300 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 4300 CLBS | |
| Additional Feature | ALSO OPERATES AT 1.1V VCC NOMINAL | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE110F1152I4LG Datasheet Download
EP3SE110F1152I4LG Overview
The EP3SE110F1152I4LG chip model is a high-performance, low-power, low-cost field-programmable gate array (FPGA) designed for a wide range of applications. This chip model is made of the latest 28nm process technology and has a rich feature set, including a large number of programmable logic elements, high-speed I/O, high-speed transceivers, and an integrated memory controller. It also has a built-in power management system, providing superior power efficiency and low power consumption.
The EP3SE110F1152I4LG chip model is designed to meet the needs of a variety of industries, including consumer electronics, automotive, industrial, and medical. It is expected that the demand for this chip model will continue to increase in the future as it provides a cost-effective solution for a variety of applications. The chip model is also suitable for use in advanced communication systems, as it has the capability to support high-speed data transmission and low latency.
The EP3SE110F1152I4LG chip model is capable of being upgraded in the future, allowing it to be used in more advanced applications. It can be used in networks, providing a reliable and secure connection, and can be used in intelligent scenarios such as voice recognition, image processing, and object recognition. It is also possible for the chip model to be used in the era of fully intelligent systems, allowing for the development of more advanced applications.
Overall, the EP3SE110F1152I4LG chip model is a powerful and versatile FPGA that can be used in a variety of industries and applications. It is expected that demand for this chip model will continue to increase in the future, as it offers a cost-effective solution for a variety of applications. The chip model is also capable of being upgraded in the future, allowing it to be used in more advanced applications, such as networks and intelligent scenarios. This chip model is an ideal choice for those looking for a powerful and versatile FPGA that can be used in a variety of industries and applications.
You May Also Be Interested In
5,034 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $21,167.9829 | $21,167.9829 |
| 10+ | $20,940.3701 | $209,403.7015 |
| 100+ | $19,802.3066 | $1,980,230.6553 |
| 1000+ | $18,664.2430 | $9,332,121.4790 |
| 10000+ | $17,070.9539 | $17,070,953.9250 |
| The price is for reference only, please refer to the actual quotation! | ||