
Intel Corporation
EP3SE110F1152I4G
EP3SE110F1152I4G ECAD Model
EP3SE110F1152I4G Attributes
Type | Description | Select |
---|---|---|
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 744 | |
Number of Outputs | 744 | |
Number of Logic Cells | 107500 | |
Number of CLBs | 4300 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Organization | 4300 CLBS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SE110F1152I4G Datasheet Download
EP3SE110F1152I4G Overview
The chip model EP3SE110F1152I4G is a high-performance, low-power device with the ability to support a wide variety of applications. It is designed to provide a complete system-on-a-chip solution for applications ranging from consumer electronics to industrial automation and communications. The chip model is based on an advanced ARM Cortex-A9 processor core and includes a wide range of peripherals, such as memory controllers, Ethernet controllers, USB controllers, and a wide range of digital signal processing (DSP) and analog interfaces.
The chip model EP3SE110F1152I4G has several advantages, including low power consumption, high performance, scalability, and flexibility. It is designed to provide a complete system-on-a-chip solution that can be used in a variety of applications. The chip model is also designed to be extremely reliable and is suitable for mission-critical applications.
In terms of industry trends, the chip model EP3SE110F1152I4G is expected to experience increased demand in the future. This is due to its ability to provide a complete system-on-a-chip solution for a wide range of applications and its scalability, flexibility, and low power consumption. It is also expected to be used in advanced communication systems, such as 5G, which will require high-performance and low-power devices.
The original design intention of the chip model EP3SE110F1152I4G is to provide a complete system-on-a-chip solution for a wide range of applications. It is designed to be highly reliable and suitable for mission-critical applications. The chip model is also designed to be flexible and scalable, allowing for upgrades and modifications in the future.
In terms of future upgrades, the chip model EP3SE110F1152I4G can be upgraded with new technologies, such as increased memory capacity, improved DSP capabilities, and more advanced communication systems. It is also possible to upgrade the chip model with new features, such as improved power management, increased security, and enhanced connectivity.
Overall, the chip model EP3SE110F1152I4G is a high-performance, low-power device with the ability to support a wide variety of applications. It is designed to provide a complete system-on-a-chip solution for applications ranging from consumer electronics to industrial automation and communications. The chip model is expected to experience increased demand in the future due to its scalability, flexibility, and low power consumption. It is also designed to be highly reliable and suitable for mission-critical applications. In terms of future upgrades, the chip model can be upgraded with new technologies and features, allowing for increased performance and enhanced connectivity.
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3,378 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $4,921.3145 | $4,921.3145 |
10+ | $4,868.3971 | $48,683.9712 |
100+ | $4,603.8103 | $460,381.0320 |
1000+ | $4,339.2235 | $2,169,611.7600 |
10000+ | $3,968.8020 | $3,968,802.0000 |
The price is for reference only, please refer to the actual quotation! |