EP3SE110F1152I4G
EP3SE110F1152I4G
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

EP3SE110F1152I4G


EP3SE110F1152I4G
F18-EP3SE110F1152I4G
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-1152
FBGA-1152

EP3SE110F1152I4G ECAD Model


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EP3SE110F1152I4G Attributes


Type Description Select
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 744
Number of Outputs 744
Number of Logic Cells 107500
Number of CLBs 4300
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Organization 4300 CLBS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B1152
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-1152
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SE110F1152I4G Datasheet Download


EP3SE110F1152I4G Overview



The chip model EP3SE110F1152I4G is a high-performance, low-power device with the ability to support a wide variety of applications. It is designed to provide a complete system-on-a-chip solution for applications ranging from consumer electronics to industrial automation and communications. The chip model is based on an advanced ARM Cortex-A9 processor core and includes a wide range of peripherals, such as memory controllers, Ethernet controllers, USB controllers, and a wide range of digital signal processing (DSP) and analog interfaces.


The chip model EP3SE110F1152I4G has several advantages, including low power consumption, high performance, scalability, and flexibility. It is designed to provide a complete system-on-a-chip solution that can be used in a variety of applications. The chip model is also designed to be extremely reliable and is suitable for mission-critical applications.


In terms of industry trends, the chip model EP3SE110F1152I4G is expected to experience increased demand in the future. This is due to its ability to provide a complete system-on-a-chip solution for a wide range of applications and its scalability, flexibility, and low power consumption. It is also expected to be used in advanced communication systems, such as 5G, which will require high-performance and low-power devices.


The original design intention of the chip model EP3SE110F1152I4G is to provide a complete system-on-a-chip solution for a wide range of applications. It is designed to be highly reliable and suitable for mission-critical applications. The chip model is also designed to be flexible and scalable, allowing for upgrades and modifications in the future.


In terms of future upgrades, the chip model EP3SE110F1152I4G can be upgraded with new technologies, such as increased memory capacity, improved DSP capabilities, and more advanced communication systems. It is also possible to upgrade the chip model with new features, such as improved power management, increased security, and enhanced connectivity.


Overall, the chip model EP3SE110F1152I4G is a high-performance, low-power device with the ability to support a wide variety of applications. It is designed to provide a complete system-on-a-chip solution for applications ranging from consumer electronics to industrial automation and communications. The chip model is expected to experience increased demand in the future due to its scalability, flexibility, and low power consumption. It is also designed to be highly reliable and suitable for mission-critical applications. In terms of future upgrades, the chip model can be upgraded with new technologies and features, allowing for increased performance and enhanced connectivity.



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Unit Price: $5,291.736
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,921.3145 $4,921.3145
10+ $4,868.3971 $48,683.9712
100+ $4,603.8103 $460,381.0320
1000+ $4,339.2235 $2,169,611.7600
10000+ $3,968.8020 $3,968,802.0000
The price is for reference only, please refer to the actual quotation!

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