
Intel Corporation
EP3SE110F1152I3G
EP3SE110F1152I3G ECAD Model
EP3SE110F1152I3G Attributes
Type | Description | Select |
---|---|---|
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 744 | |
Number of Outputs | 744 | |
Number of Logic Cells | 107500 | |
Number of CLBs | 4300 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Organization | 4300 CLBS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SE110F1152I3G Datasheet Download
EP3SE110F1152I3G Overview
The chip model EP3SE110F1152I3G is a multi-function, high-performance device that has become increasingly popular in the electronics industry. It is a highly integrated device that combines a variety of functions, such as memory, processor, analog-to-digital conversion, and digital-to-analog conversion, into a single chip. This chip model has been designed to meet the needs of a wide range of applications, including industrial automation, medical equipment, automotive electronics, and consumer electronics.
The EP3SE110F1152I3G chip model has many advantages, such as low power consumption, high speed, and high reliability. It is also highly cost-effective, making it a preferred choice for many applications. In addition, its flexibility makes it suitable for a wide range of applications, including high-end industrial automation and consumer electronics. Furthermore, the chip model is compatible with a variety of operating systems, making it easy to integrate into existing systems.
The expected demand trends for the EP3SE110F1152I3G chip model in related industries in the future will likely continue to grow. As more and more applications become automated, the demand for high-performance, low-cost chip models such as the EP3SE110F1152I3G will only increase. Furthermore, with the rise of the Internet of Things, the demand for high-speed and reliable chip models will also increase.
In terms of product description and design requirements, the EP3SE110F1152I3G chip model is designed to meet the needs of a wide range of applications. It is equipped with a high-speed processor, a memory, an analog-to-digital converter, and a digital-to-analog converter. It also has a low power consumption, a high speed, and a high reliability. Furthermore, it is highly cost-effective and is compatible with a variety of operating systems.
To ensure the successful use of the EP3SE110F1152I3G chip model, there are a few precautions that should be taken. First, the device should be carefully tested and inspected before being used in any application. Second, the device should be used in accordance with the manufacturer’s instructions. Third, the device should be regularly monitored and maintained to ensure its optimal performance. Finally, the device should be periodically upgraded to ensure that it is compatible with the latest software and hardware.
In terms of applications, the EP3SE110F1152I3G chip model can be used in the development and popularization of future intelligent robots. This chip model is highly integrated and can be used to control a variety of components, such as sensors, motors, and actuators. Furthermore, its high speed and low power consumption make it suitable for use in robotic applications. In order to use this chip model effectively, however, engineers and technicians need to have a strong knowledge of robotics, computer science, and electronics. They should also be familiar with the device’s programming language and have a good understanding of the device’s hardware architecture.
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1,127 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $6,398.5637 | $6,398.5637 |
10+ | $6,329.7619 | $63,297.6192 |
100+ | $5,985.7531 | $598,575.3120 |
1000+ | $5,641.7443 | $2,820,872.1600 |
10000+ | $5,160.1320 | $5,160,132.0000 |
The price is for reference only, please refer to the actual quotation! |