Intel Corporation
EP3SE110F1152C4LN
EP3SE110F1152C4LN ECAD Model
EP3SE110F1152C4LN Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 107500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.9 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE110F1152C4LN Datasheet Download
EP3SE110F1152C4LN Overview
The chip model EP3SE110F1152C4LN is a powerful and versatile device, designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is capable of handling complex operations, and requires the use of HDL language for programming.
The chip model EP3SE110F1152C4LN is currently used in a variety of industries, from automotive and aerospace to medical and industrial. With the rapid development of technology, the chip model EP3SE110F1152C4LN is expected to become even more versatile and powerful, and its usage will expand to new areas.
In the future, the chip model EP3SE110F1152C4LN is likely to be used in networks and intelligent systems. It can be used to process large amounts of data quickly, and it can be used to create sophisticated algorithms for problem-solving. It is also possible that the chip model EP3SE110F1152C4LN will be used in the era of fully intelligent systems, allowing for the development of artificial intelligence and machine learning applications.
In order to keep up with the industry trends, the chip model EP3SE110F1152C4LN will need to be supported by new technologies. These may include faster processors, increased memory, and improved algorithms. Additionally, new technologies such as quantum computing could be used to further increase the capabilities of the chip model EP3SE110F1152C4LN.
The chip model EP3SE110F1152C4LN is a powerful device, and its potential applications are vast. As technology continues to develop, the possibilities of what can be achieved with the chip model EP3SE110F1152C4LN are only limited by the imagination. With the right support and development, the chip model EP3SE110F1152C4LN could become a powerful tool in the future of intelligent systems.
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5,527 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,118.2952 | $3,118.2952 |
| 10+ | $3,084.7652 | $30,847.6515 |
| 100+ | $2,917.1149 | $291,711.4872 |
| 1000+ | $2,749.4646 | $1,374,732.2960 |
| 10000+ | $2,514.7542 | $2,514,754.2000 |
| The price is for reference only, please refer to the actual quotation! | ||