Intel Corporation
EP3SE110F1152C4LG
EP3SE110F1152C4LG ECAD Model
EP3SE110F1152C4LG Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Logic Cells | 107500 | |
| Number of CLBs | 4300 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 4300 CLBS | |
| Additional Feature | ALSO OPERATES AT 1.1V VCC NOMINAL | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE110F1152C4LG Datasheet Download
EP3SE110F1152C4LG Overview
The chip model EP3SE110F1152C4LG is a high-performance, low-power programmable logic device designed for digital signal processing, embedded processing and image processing applications. With its advanced features and capabilities, this chip model is ideal for a wide range of applications in the industrial, medical, automotive and consumer markets.
The EP3SE110F1152C4LG is based on a high-speed, low-power, single-chip architecture that enables it to support high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to meet the needs of high-performance, low-power, and cost-effective applications, while providing the flexibility and scalability to support future upgrades and enhancements.
The EP3SE110F1152C4LG is designed to be programmed using the HDL (Hardware Description Language) language, which is used to describe the hardware design of the chip. This allows for the development of complex hardware designs, while also providing a higher level of control over the design process.
The EP3SE110F1152C4LG is designed to provide high performance, low power consumption, and high scalability. It is capable of running at speeds up to 800 MHz and supports up to 8 Gb of on-chip memory. It is also designed to be highly reliable and robust, and is capable of supporting a wide range of applications.
The EP3SE110F1152C4LG is also designed to be easily upgradable and is capable of supporting advanced communication systems. The chip model is designed to be able to support a wide range of protocols, including Ethernet, USB, and Wi-Fi. It also provides support for advanced security protocols, such as AES and SSL/TLS.
The EP3SE110F1152C4LG is designed to meet the needs of high-performance, low-power, and cost-effective applications, while providing the flexibility and scalability to support future upgrades and enhancements. As the demand for high-performance, low-power, and cost-effective solutions continues to rise, the EP3SE110F1152C4LG is expected to remain a popular choice among users. With its advanced features and capabilities, this chip model is sure to remain a top choice for many applications in the future.
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5,608 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,680.2689 | $5,680.2689 |
| 10+ | $5,619.1907 | $56,191.9072 |
| 100+ | $5,313.7999 | $531,379.9920 |
| 1000+ | $5,008.4091 | $2,504,204.5600 |
| 10000+ | $4,580.8620 | $4,580,862.0000 |
| The price is for reference only, please refer to the actual quotation! | ||