
Intel Corporation
EP3SE110F1152C4L
EP3SE110F1152C4L ECAD Model
EP3SE110F1152C4L Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 744 | |
Number of Outputs | 744 | |
Number of Logic Cells | 107500 | |
Number of CLBs | 4300 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 4300 CLBS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Power Supplies | 1.2/3.3 V | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SE110F1152C4L Datasheet Download
EP3SE110F1152C4L Overview
The chip model EP3SE110F1152C4L is a state-of-the-art solution for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a powerful tool for designing and implementing digital systems. With its high-speed, low-power, and low-cost features, EP3SE110F1152C4L is a popular choice for many applications.
The industry trends of the chip model EP3SE110F1152C4L are closely related to the development of new technologies. As technology advances, new applications are created, and the need for more powerful chips increases. The chip model EP3SE110F1152C4L is designed to meet the demands of these applications, and its features make it an ideal choice for many applications.
The chip model EP3SE110F1152C4L can be used to develop and popularize future intelligent robots. With its powerful features, this chip model can be used to create robots that are capable of performing complex tasks. The chip model EP3SE110F1152C4L is also capable of providing the necessary computing power for robots to interact with their environment. In order to use the chip model EP3SE110F1152C4L effectively, a team of technical talents with expertise in HDL language and robotics will be necessary.
The chip model EP3SE110F1152C4L is an excellent choice for high-performance digital signal processing, embedded processing, and image processing. With its powerful features, it is an ideal choice for many applications. As technology advances, the need for more powerful chips increases, and the chip model EP3SE110F1152C4L is designed to meet the demands of these applications. Additionally, the chip model EP3SE110F1152C4L can be used to develop and popularize future intelligent robots, and a team of technical talents with expertise in HDL language and robotics will be necessary to use the chip model effectively.
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4,684 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $3,430.1201 | $3,430.1201 |
10+ | $3,393.2371 | $33,932.3710 |
100+ | $3,208.8220 | $320,882.2044 |
1000+ | $3,024.4070 | $1,512,203.4920 |
10000+ | $2,766.2259 | $2,766,225.9000 |
The price is for reference only, please refer to the actual quotation! |