
Intel Corporation
EP3SE110F1152C4
EP3SE110F1152C4 ECAD Model
EP3SE110F1152C4 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 744 | |
Number of Outputs | 744 | |
Number of Logic Cells | 107500 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Clock Frequency-Max | 717 MHz | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.9 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SE110F1152C4 Datasheet Download
EP3SE110F1152C4 Overview
The chip model EP3SE110F1152C4 is a field programmable gate array (FPGA) developed by Altera, a well-known semiconductor company. It is designed to meet the needs of high-speed, high-bandwidth applications, such as high-performance computing, high-speed networking, and multimedia applications. It has a wide range of features, including high-performance logic, memory, and I/O elements. It also offers a high level of flexibility and scalability, allowing users to customize the design to meet their specific needs.
The chip model EP3SE110F1152C4 has many advantages, such as low power consumption, high performance, and scalability. This has led to its increasing demand in related industries, such as automotive, medical, industrial, and military applications. As the demand for higher performance, lower power consumption, and greater flexibility increases, the EP3SE110F1152C4 is expected to become an even more popular choice for these industries.
In addition, the chip model EP3SE110F1152C4 is expected to be applied in the next generation of networks and intelligent scenarios. It can be used in 5G networks and the Internet of Things (IoT) for data processing and communication. It can also be used in autonomous vehicles and intelligent home appliances for decision making and control. In the era of fully intelligent systems, the EP3SE110F1152C4 can be used to provide the necessary computing power and communication capabilities.
In order to meet the needs of these applications, the chip model EP3SE110F1152C4 needs to be supported by new technologies. For example, it needs to be integrated with artificial intelligence, machine learning, and deep learning technologies to enable it to process large amounts of data and make decisions quickly. It also needs to be integrated with advanced security technologies to ensure the data is secure and the system is reliable.
In conclusion, the chip model EP3SE110F1152C4 is a high-performance, low-power, and highly scalable FPGA. It is expected to be in high demand in related industries in the future, and it can be applied in networks and intelligent scenarios. To meet the needs of these applications, it needs to be supported by new technologies such as artificial intelligence, machine learning, and deep learning.
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4,776 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,286.4075 | $2,286.4075 |
10+ | $2,261.8225 | $22,618.2248 |
100+ | $2,138.8973 | $213,889.7349 |
1000+ | $2,015.9722 | $1,007,986.1070 |
10000+ | $1,843.8770 | $1,843,877.0250 |
The price is for reference only, please refer to the actual quotation! |