Intel Corporation
EP3SE110F1152C3
EP3SE110F1152C3 ECAD Model
EP3SE110F1152C3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 107500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.9 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE110F1152C3 Datasheet Download
EP3SE110F1152C3 Overview
The EP3SE110F1152C3 chip model is a powerful device that is suitable for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a hardware description language that enables the design of integrated circuits. This chip model is perfect for applications such as wireless communication, automotive, industrial, and consumer electronics.
The EP3SE110F1152C3 chip model offers several advantages over other chip models. It has a high-speed processor with a clock speed of up to 1.5GHz, which enables faster processing of data. It also has a large memory capacity, which is great for storing and processing large amounts of data. Additionally, it is power efficient and has low power consumption, making it an ideal choice for battery-powered applications.
The expected demand for the EP3SE110F1152C3 chip model is expected to grow in the future due to its versatile capabilities. It is expected to be used in a variety of applications such as network infrastructure, automotive, industrial, and consumer electronics. Additionally, it is expected to be used in the development of intelligent systems and applications. The chip model is expected to be used in the development of intelligent control systems, autonomous vehicles, and smart home applications.
The EP3SE110F1152C3 chip model is expected to be used in networks and intelligent scenarios in the future. The chip model is expected to be used in the development of intelligent networks, which will enable faster and more reliable data transmission. Additionally, it is expected to be used in the development of autonomous systems, such as autonomous vehicles, intelligent robots, and smart home applications. Finally, the chip model is expected to be used in the development of fully intelligent systems, such as artificial intelligence and machine learning.
The EP3SE110F1152C3 chip model is a powerful device that is suitable for a variety of applications. It offers several advantages, such as a high-speed processor and large memory capacity. The expected demand for the chip model is expected to grow in the future due to its versatile capabilities. It is expected to be used in the development of intelligent networks, autonomous systems, and fully intelligent systems.
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5,647 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,971.8113 | $2,971.8113 |
| 10+ | $2,939.8563 | $29,398.5632 |
| 100+ | $2,780.0815 | $278,008.1520 |
| 1000+ | $2,620.3067 | $1,310,153.3600 |
| 10000+ | $2,396.6220 | $2,396,622.0000 |
| The price is for reference only, please refer to the actual quotation! | ||