Intel Corporation
EP3SE110F1152C2
EP3SE110F1152C2 ECAD Model
EP3SE110F1152C2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 107500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 800 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.9 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE110F1152C2 Datasheet Download
EP3SE110F1152C2 Overview
The chip model EP3SE110F1152C2 is a high-performance digital signal processor (DSP) designed to meet the needs of embedded processing, image processing, and other digital signal processing (DSP) applications. It is designed with the HDL language, which is the most commonly used language for designing and developing digital signal processors.
The chip model EP3SE110F1152C2 was designed with the intention of providing a powerful and efficient platform for digital signal processing. The design allows for the possibility of future upgrades, which could include the addition of more powerful processing capabilities, better memory management, and improved data transmission speeds. With its current design, the chip model EP3SE110F1152C2 is capable of handling a wide range of digital signal processing tasks, making it suitable for a variety of applications.
The chip model EP3SE110F1152C2 has the potential to be used in advanced communication systems, such as 5G networks, due to its advanced processing capabilities. It is also capable of being used in intelligent scenarios, such as machine learning and artificial intelligence. With its advanced processing power, the chip model EP3SE110F1152C2 could be used to power a variety of intelligent applications, such as autonomous vehicles, smart home systems, and smart medical devices.
The chip model EP3SE110F1152C2 is capable of being used in the era of fully intelligent systems. With its advanced processing capabilities, it could be used to power a wide range of applications that require a high level of intelligence. For example, it could be used to power autonomous robots, intelligent surveillance systems, and natural language processing systems.
Overall, the chip model EP3SE110F1152C2 is a powerful and efficient platform for digital signal processing. It is capable of being used in a variety of applications, from advanced communication systems to intelligent scenarios. It is also capable of being used in the era of fully intelligent systems, making it an ideal choice for those who want to take advantage of the latest advancements in digital signal processing.
You May Also Be Interested In
2,638 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,863.8721 | $3,863.8721 |
| 10+ | $3,822.3251 | $38,223.2510 |
| 100+ | $3,614.5900 | $361,459.0044 |
| 1000+ | $3,406.8550 | $1,703,427.4920 |
| 10000+ | $3,116.0259 | $3,116,025.9000 |
| The price is for reference only, please refer to the actual quotation! | ||