EP3CLS100U484C8N
EP3CLS100U484C8N
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Intel Corporation

EP3CLS100U484C8N


EP3CLS100U484C8N
F18-EP3CLS100U484C8N
Active
IC FPGA 278 I/O 484UBGA
484-UBGA (19x19)

EP3CLS100U484C8N ECAD Model


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EP3CLS100U484C8N Attributes


Type Description Select
Mfr Intel
Series Cyclone® III
Package Tray
Number of LABs/CLBs 6278
Number of Logic Elements/Cells 100448
Total RAM Bits 4451328
Number of I/O 278
Voltage - Supply 1.15V ~ 1.25V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 484-FBGA
Supplier Device Package 484-UBGA (19x19)
Base Product Number EP3CLS100

EP3CLS100U484C8N Datasheet Download


EP3CLS100U484C8N Overview



The EP3CLS100U484C8N is an Altera Stratix III FPGA device designed for high-speed, low-power, and high-density applications. It is based on the advanced 65nm low-power process, and features a total of 100,000 logic elements, 484 user I/O pins, and 8 hard PLLs. It is capable of operating at up to 350MHz, and can provide up to 1.5Gbps of serial data transfer rate.


The EP3CLS100U484C8N is designed for high-performance applications such as video and image processing, digital signal processing, and high-speed communications. It is also suitable for low-power applications such as embedded systems and portable devices. This device is also suitable for high-density applications such as system-on-chip designs.


The EP3CLS100U484C8N supports a wide range of features such as embedded memory blocks, embedded multipliers, embedded hard PLLs, and embedded high-speed transceivers. The device also supports a wide range of I/O standards including LVDS, LVPECL, and SSTL. The device also features a range of power saving features such as dynamic power management and power-down modes.


The EP3CLS100U484C8N is well suited for high-speed, low-power, and high-density applications. It is capable of operating at up to 350MHz, and provides up to 1.5Gbps of serial data transfer rate. It is also suitable for a wide range of applications such as video and image processing, digital signal processing, high-speed communications, embedded systems, and system-on-chip designs.



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