
Intel Corporation
EP3CLS100F780I7N
EP3CLS100F780I7N ECAD Model
EP3CLS100F780I7N Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Cyclone® III | |
Package | Tray | |
Number of LABs/CLBs | 6278 | |
Number of Logic Elements/Cells | 100448 | |
Total RAM Bits | 4451328 | |
Number of I/O | 413 | |
Voltage - Supply | 1.15V ~ 1.25V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 780-BGA | |
Supplier Device Package | 780-FBGA (29x29) | |
Base Product Number | EP3CLS100 |
EP3CLS100F780I7N Datasheet Download
EP3CLS100F780I7N Overview
The EP3CLS100F780I7N is a low-power, high-performance FPGA from Altera. It is a member of the Stratix III family, which is designed for high-speed, high-density applications. The device has a total of 8,000 logic elements and is capable of delivering up to 780MHz of system performance. It also features four independent Gigabit transceivers, as well as 4,096 Kbits of embedded memory.
The EP3CLS100F780I7N is designed to provide high-speed, high-density solutions in a wide range of applications. It is ideal for applications such as high-speed networking, video streaming, medical imaging, and high-end computing. It is also suitable for use in automotive, aerospace, and industrial applications.
The device features a wide range of features, including a low-power design, high-performance transceiver, and high-density logic. It also has an integrated power-on reset circuit and on-chip termination resistors. Additionally, the device is equipped with a JTAG port for programming and debugging.
In terms of specifications, the EP3CLS100F780I7N has a power consumption of up to 2.2W and a maximum operating temperature of 85°C. It is available in a variety of packages, including a 100-pin BGA, 144-pin TQFP, and a 144-pin LFBGA.
Overall, the EP3CLS100F780I7N is a powerful, low-power FPGA designed for high-speed, high-density applications. It is suitable for a wide range of applications, including high-speed networking, video streaming, medical imaging, and high-end computing. It is also suitable for use in automotive, aerospace, and industrial applications.
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