Intel Corporation
EP3C40F324A7N
EP3C40F324A7N ECAD Model
EP3C40F324A7N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 195 | |
| Number of Outputs | 195 | |
| Number of Logic Cells | 39600 | |
| Number of CLBs | 39600 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | AUTOMOTIVE | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 39600 CLBS | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-324 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
EP3C40F324A7N Datasheet Download
EP3C40F324A7N Overview
The chip model EP3C40F324A7N is a high-end FPGA chip developed by Altera, a subsidiary of Intel. It is based on the 40 nm CMOS process and integrates more than 324 thousand logic cells. It is widely used in the fields of communication, industrial control, image processing and other industries.
In terms of industry trends, the EP3C40F324A7N chip has the potential to be applied to more advanced communication systems, such as 5G and beyond. It has the potential to support new technologies such as artificial intelligence, machine learning, and blockchain. In addition, the chip can be used in intelligent scenarios such as autonomous driving, smart cities, and other emerging technologies.
The chip is designed with a wide range of features such as high-speed transceivers, high-speed SERDES, and high-speed I/Os. It also has high-performance DSP blocks and embedded memory blocks, which can be used for various applications. The chip has a high degree of scalability and flexibility, which makes it possible to be used in the era of fully intelligent systems.
In terms of future upgrades, the EP3C40F324A7N chip can be upgraded to support more advanced technologies. For example, it can be upgraded to support more advanced algorithms for artificial intelligence and machine learning. It can also be upgraded to support more advanced communication protocols, such as 5G and beyond.
In conclusion, the chip model EP3C40F324A7N is a high-end FPGA chip with great potential in the field of communication and industrial control. It has the potential to be applied to advanced communication systems, intelligent scenarios, and the era of fully intelligent systems. It has a high degree of scalability and flexibility, and can be upgraded to support more advanced technologies.
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4,973 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,029.9039 | $1,029.9039 |
| 10+ | $1,018.8296 | $10,188.2962 |
| 100+ | $963.4584 | $96,345.8445 |
| 1000+ | $908.0873 | $454,043.6350 |
| 10000+ | $830.5676 | $830,567.6250 |
| The price is for reference only, please refer to the actual quotation! | ||