Intel Corporation
EP3C25F324C6
EP3C25F324C6 ECAD Model
EP3C25F324C6 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 215 | |
| Number of Outputs | 215 | |
| Number of Logic Cells | 24624 | |
| Number of CLBs | 24624 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 24624 CLBS | |
| Clock Frequency-Max | 472.5 MHz | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 1.9 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 19 X 19 MM, 1 MM PITCH, FBGA-324 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3C25F324C6 Datasheet Download
EP3C25F324C6 Overview
The chip model EP3C25F324C6 is a powerful and versatile model that has been gaining traction in the chip industry. This model is based on the Altera Cyclone III FPGA and offers a high level of integration and performance. It has been used in a wide range of applications, such as automotive, industrial, and consumer electronics.
The chip model EP3C25F324C6 has several advantages that make it attractive to industry professionals. First, it offers low power consumption, which makes it suitable for applications that need to be energy efficient. It also has a high level of integration, which makes it easier to integrate into existing systems. Additionally, it offers a high level of flexibility, which makes it easier to customize for specific applications.
In the future, the demand for the chip model EP3C25F324C6 is expected to grow in the automotive, industrial, and consumer electronics sectors. This is due to its versatility and low power consumption. Automotive applications are expected to benefit from its high level of integration and flexibility, while industrial and consumer electronics applications are expected to benefit from its low power consumption.
The chip model EP3C25F324C6 can be used to develop and popularize future intelligent robots. Its low power consumption, high level of integration, and flexibility make it a suitable choice for robotic applications. Furthermore, its performance and scalability make it suitable for various types of robotic applications. To use the chip model EP3C25F324C6 effectively, technical talents such as software engineers, hardware engineers, and roboticists are needed.
Overall, the chip model EP3C25F324C6 is a powerful and versatile model that has been gaining traction in the chip industry. It offers a high level of integration and performance, as well as low power consumption. This makes it suitable for a wide range of applications, such as automotive, industrial, and consumer electronics. In the future, the demand for the chip model EP3C25F324C6 is expected to grow in these sectors, and it can also be used to develop and popularize future intelligent robots. To use the chip model EP3C25F324C6 effectively, technical talents such as software engineers, hardware engineers, and roboticists are needed.
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5,066 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $57.2234 | $57.2234 |
| 10+ | $56.6081 | $566.0806 |
| 100+ | $53.5315 | $5,353.1535 |
| 1000+ | $50.4550 | $25,227.5050 |
| 10000+ | $46.1479 | $46,147.8750 |
| The price is for reference only, please refer to the actual quotation! | ||