Intel Corporation
EP3C25F256C7
EP3C25F256C7 ECAD Model
EP3C25F256C7 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 156 | |
| Number of Outputs | 156 | |
| Number of Logic Cells | 24624 | |
| Number of CLBs | 24624 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 24624 CLBS | |
| Clock Frequency-Max | 472.5 MHz | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 17 X 17 MM, 1 MM PITCH, FBGA-256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3C25F256C7 Datasheet Download
EP3C25F256C7 Overview
The chip model EP3C25F256C7 is a high-performance device designed for digital signal processing, embedded processing, image processing, and other applications. It is capable of handling complex tasks with a high degree of accuracy and speed, and requires the use of HDL language for programming. This makes the EP3C25F256C7 a great choice for those looking for a powerful and reliable chip for their projects.
The future development of the EP3C25F256C7 and related industries depends on the specific technologies that are needed. New technologies such as artificial intelligence, machine learning, and 5G networks can all be used to enhance the capabilities of the chip, allowing it to be used in more advanced applications.
The EP3C25F256C7 can be applied to the development and popularization of future intelligent robots, as it can be used to control and monitor their movements. This chip is capable of handling complex tasks with a high degree of accuracy and speed, making it an ideal choice for robotic applications. Technical talents such as software engineers and hardware engineers are needed to use the model effectively. These professionals must be knowledgeable in HDL language and have a deep understanding of robotics, as well as the latest technologies and trends in the industry.
In conclusion, the EP3C25F256C7 is a powerful and reliable chip for digital signal processing, embedded processing, image processing, and other applications. It is capable of handling complex tasks with a high degree of accuracy and speed, and requires the use of HDL language for programming. This chip can be used for the development and popularization of future intelligent robots, and technical talents such as software engineers and hardware engineers are needed to use the model effectively.
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1,648 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $110.9198 | $110.9198 |
| 10+ | $109.7271 | $1,097.2711 |
| 100+ | $103.7637 | $10,376.3682 |
| 1000+ | $97.8003 | $48,900.1260 |
| 10000+ | $89.4515 | $89,451.4500 |
| The price is for reference only, please refer to the actual quotation! | ||