Intel Corporation
EP3C10F256A7N
EP3C10F256A7N ECAD Model
EP3C10F256A7N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 182 | |
| Number of Outputs | 182 | |
| Number of Logic Cells | 10320 | |
| Number of CLBs | 10320 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | AUTOMOTIVE | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 10320 CLBS | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, MS-034, FBGA-256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3C10F256A7N Datasheet Download
EP3C10F256A7N Overview
The EP3C10F256A7N chip model is a powerful, high-performance digital signal processor, embedded processor, and image processor. It is capable of handling a wide range of applications, from simple digital signal processing to complex image processing. It is designed to be used with the HDL language, making it an ideal choice for a variety of applications.
The EP3C10F256A7N chip model is a versatile and powerful device, capable of handling a wide range of tasks. It is well suited for high-performance digital signal processing, embedded processing, and image processing. It has the ability to process large amounts of data quickly, making it suitable for applications such as artificial intelligence and machine learning.
The EP3C10F256A7N chip model is also well suited for use in networked systems, allowing for the transmission of data between multiple devices. It can also be used in intelligent scenarios, such as automated control systems and smart home systems. The chip model is also able to integrate with other technologies, such as Bluetooth and Wi-Fi, allowing for further possibilities.
The EP3C10F256A7N chip model is a powerful device that is well suited for a wide range of applications. It is capable of handling complex tasks and is designed to be used with the HDL language. It is suitable for use in networks, intelligent scenarios, and can be integrated with other technologies. The chip model is an ideal choice for those looking for a powerful, high-performance processor for their applications.
As the technology industry continues to evolve, the EP3C10F256A7N chip model will continue to be a powerful and versatile device. It is capable of handling complex tasks, and can be integrated with other technologies. It is well suited for use in networks, intelligent scenarios, and is capable of handling large amounts of data quickly. As the technology industry continues to advance, the EP3C10F256A7N chip model will continue to be a powerful and versatile device, capable of being used in the era of fully intelligent systems.
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2,039 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $95.6469 | $95.6469 |
| 10+ | $94.6184 | $946.1841 |
| 100+ | $89.4761 | $8,947.6107 |
| 1000+ | $84.3338 | $42,166.9010 |
| 10000+ | $77.1346 | $77,134.5750 |
| The price is for reference only, please refer to the actual quotation! | ||