EP2SGX90EF1152C3N
EP2SGX90EF1152C3N
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Intel Corporation

EP2SGX90EF1152C3N


EP2SGX90EF1152C3N
F18-EP2SGX90EF1152C3N
Active
IC FPGA 558 I/O 1152FBGA
1152-FBGA (35x35)

EP2SGX90EF1152C3N ECAD Model


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EP2SGX90EF1152C3N Attributes


Type Description Select
Mfr Intel
Series Stratix® II GX
Package Tray
Number of LABs/CLBs 4548
Number of Logic Elements/Cells 90960
Total RAM Bits 4520448
Number of I/O 558
Voltage - Supply 1.15V ~ 1.25V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1152-BBGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number EP2SGX90

EP2SGX90EF1152C3N Datasheet Download


EP2SGX90EF1152C3N Overview



The EP2SGX90EF1152C3N is a FPGA chip manufactured by Altera Corporation. It is a member of the Stratix II family of FPGAs and is based on a 90-nanometer process technology. This chip has a total of 1152 logic elements, and it has a total of 672 embedded multipliers, which can be used for high-speed computations. It also has up to 1.5 Mbits of embedded memory, which can be used for storing data. This chip has a total of 8 PLLs, which can be used for clock synthesis and frequency synthesizing. It also has a total of 4 transceivers, which can be used for high-speed communication.


The EP2SGX90EF1152C3N is suitable for a variety of applications, including digital signal processing, embedded systems, video and imaging processing, networking, and high-speed communications. It can also be used for high-speed data acquisition and processing, as well as for high-speed data transmission. This chip has a low power consumption, which makes it suitable for battery-powered devices. It also has a high level of integration, which allows for the implementation of complex systems on a single chip.


Overall, the EP2SGX90EF1152C3N is a powerful FPGA chip that is suitable for a wide range of applications. It has a high level of integration, low power consumption, and a large number of embedded resources. This makes it an ideal choice for embedded systems, digital signal processing, and high-speed communication applications.



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