EP2SGX60DF780I4
EP2SGX60DF780I4
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Intel Corporation

EP2SGX60DF780I4


EP2SGX60DF780I4
F18-EP2SGX60DF780I4
Active
IC FPGA 364 I/O 780FBGA
780-FBGA (29x29)

EP2SGX60DF780I4 ECAD Model


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EP2SGX60DF780I4 Attributes


Type Description Select
Mfr Intel
Series Stratix® II GX
Package Tray
Number of LABs/CLBs 3022
Number of Logic Elements/Cells 60440
Total RAM Bits 2544192
Number of I/O 364
Voltage - Supply 1.15V ~ 1.25V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 780-BBGA
Supplier Device Package 780-FBGA (29x29)
Base Product Number EP2SGX60

EP2SGX60DF780I4 Datasheet Download


EP2SGX60DF780I4 Overview



The EP2SGX60DF780I4 is a low-power FPGA chip from Altera Corporation. It is a member of the Stratix II GX family of FPGAs, and is designed for high-performance and low-power applications. The chip has a total of 780 logic elements, and is built using a 90nm process. It has an embedded memory of up to 2.5 Mbits, and features up to 576 I/O pins, with up to 24 transceivers. It also supports up to four independent clock domains.


The EP2SGX60DF780I4 has a wide range of applications, including high-speed networking, digital signal processing, and embedded systems. It can be used for data transfer, communication, and storage applications, as well as for video and image processing. It is also suitable for use in automotive, aerospace, and defense applications.


The chip has an operating voltage range of 1.2V to 3.3V, and a maximum operating temperature of 85°C. It also has an advanced power management system, which allows for low power consumption. It is available in a variety of packages, including a BGA package with a die size of 12.5mm x 12.5mm.


In conclusion, the EP2SGX60DF780I4 is a powerful and low-power FPGA chip, which is suitable for a wide range of applications. It has a wide range of features, such as an embedded memory, multiple I/O pins, and multiple clock domains, which make it suitable for a variety of applications.



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