
Intel Corporation
EP2SGX60DF780C3
EP2SGX60DF780C3 ECAD Model
EP2SGX60DF780C3 Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Stratix® II GX | |
Package | Tray | |
Number of LABs/CLBs | 3022 | |
Number of Logic Elements/Cells | 60440 | |
Total RAM Bits | 2544192 | |
Number of I/O | 364 | |
Voltage - Supply | 1.15V ~ 1.25V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 780-BBGA | |
Supplier Device Package | 780-FBGA (29x29) | |
Base Product Number | EP2SGX60 |
EP2SGX60DF780C3 Datasheet Download
EP2SGX60DF780C3 Overview
The EP2SGX60DF780C3 is a field programmable gate array (FPGA) chip from Altera Corporation. It is a member of the Stratix II family of FPGAs and is based on the 90 nm process technology. It has a total of 780,000 logic elements and provides up to 8.8 million system gates. It has a maximum operating frequency of 400 MHz and a maximum internal operating voltage of 1.2 V.
The chip features an array of embedded memory blocks, including 8,192 embedded RAM blocks, 4,096 embedded multipliers and 4,096 embedded DSP blocks. It also supports up to 1,024 user-defined I/O pins and up to 32 dedicated high-speed differential I/O pairs. In addition, it has a built-in JTAG interface for configuration and debugging.
The EP2SGX60DF780C3 is suitable for a wide range of applications, including high-bandwidth data transfer, video processing, digital signal processing, and system-level integration. It is also suitable for use in high-speed networking, aerospace and defense, medical imaging, and other applications that require high-performance FPGAs. Additionally, it is suitable for use in embedded systems, industrial automation, and automotive applications.
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