EP2SGX60CF780C5N
EP2SGX60CF780C5N
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Intel Corporation

EP2SGX60CF780C5N


EP2SGX60CF780C5N
F18-EP2SGX60CF780C5N
Active
IC FPGA 364 I/O 780FBGA
780-FBGA (29x29)

EP2SGX60CF780C5N ECAD Model


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EP2SGX60CF780C5N Attributes


Type Description Select
Mfr Intel
Series Stratix® II GX
Package Tray
Number of LABs/CLBs 3022
Number of Logic Elements/Cells 60440
Total RAM Bits 2544192
Number of I/O 364
Voltage - Supply 1.15V ~ 1.25V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 780-BBGA
Supplier Device Package 780-FBGA (29x29)
Base Product Number EP2SGX60

EP2SGX60CF780C5N Datasheet Download


EP2SGX60CF780C5N Overview



The EP2SGX60CF780C5N is a Field Programmable Gate Array (FPGA) chip manufactured by Altera Corporation. It is a low-power, high-performance device based on the Stratix II GX architecture and is designed to meet the performance and cost requirements of embedded applications. It features up to 780K logic elements and up to 13.2Mb of embedded memory. It has up to 740 user I/O pins and is supported by a comprehensive set of design tools and software.


The EP2SGX60CF780C5N is suitable for a variety of applications such as video and image processing, wireless communication, automotive and industrial control, and medical imaging. It features high-speed transceivers, embedded multipliers, and high-performance DSP blocks. It also supports multiple clock domains, allowing for efficient implementation of complex designs. It is also compatible with a variety of third-party IP cores, allowing for integration of existing designs.


The EP2SGX60CF780C5N is packaged in a 790-pin BGA package and is rated for operation over a temperature range of 0 to 85 degrees Celsius. It has a maximum power consumption of 15W and a maximum clock frequency of 250MHz. It is also compliant with the JEDEC standards for ESD and latchup immunity.


In summary, the EP2SGX60CF780C5N is a high-performance and low-power FPGA chip suitable for a variety of embedded applications. It features a large number of logic elements, embedded memory, I/O pins, and DSP blocks, as well as support for multiple clock domains and third-party IP cores. It is packaged in a 790-pin BGA package and is rated for operation over a temperature range of 0 to 85 degrees Celsius.



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