
Intel Corporation
EP2S90F1508C3
EP2S90F1508C3 ECAD Model
EP2S90F1508C3 Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Stratix® II | |
Package | Tray | |
Number of LABs/CLBs | 4548 | |
Number of Logic Elements/Cells | 90960 | |
Total RAM Bits | 4520488 | |
Number of I/O | 902 | |
Voltage - Supply | 1.15V ~ 1.25V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 1508-BBGA, FCBGA | |
Supplier Device Package | 1508-FBGA, FC (40x40) | |
Base Product Number | EP2S90 |
EP2S90F1508C3 Datasheet Download
EP2S90F1508C3 Overview
The EP2S90F1508C3 is an FPGA chip model manufactured by Altera. It is based on the Stratix II GX architecture and is a member of the Stratix II family. It is a high-performance, low-power FPGA device that includes two independent 1.5Gbps transceivers and up to 90,000 logic elements. It is available in a 745-pin BGA package and is designed for use in high-speed, high-density applications.
The EP2S90F1508C3 has a range of features that make it ideal for a variety of applications. It offers a wide range of I/O options, including LVDS, LVPECL, and PECL. It also has an integrated high-speed transceiver that supports up to 1.5Gbps data rates. Additionally, it has a variety of memory options, such as DDR2, QDRII, RLDRAM II, and M4K blocks.
The EP2S90F1508C3 is suitable for a variety of applications, including high-speed communications, industrial automation, video processing, and test and measurement. It can be used to create high-speed designs that require high levels of performance and low power consumption. Additionally, it is suitable for high-density applications that require a large number of I/O pins and high-speed transceivers.
Overall, the EP2S90F1508C3 is a high-performance, low-power FPGA chip that is suitable for a variety of applications. It offers a wide range of features, including two independent 1.5Gbps transceivers, LVDS, LVPECL, and PECL I/O options, and a range of memory options. It is suitable for high-speed communications, industrial automation, video processing, and test and measurement applications.
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