Intel Corporation
EP2C20AF256A7N
EP2C20AF256A7N ECAD Model
EP2C20AF256A7N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of CLBs | 1172 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | AUTOMOTIVE | |
| Package Shape | SQUARE | |
| Organization | 1172 CLBS | |
| Clock Frequency-Max | 450 MHz | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP2C20AF256A7N Datasheet Download
EP2C20AF256A7N Overview
The EP2C20AF256A7N chip model is a high-performance, low-power FPGA (Field Programmable Gate Array) model that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It is a powerful and versatile model that can be used in a variety of scenarios and is programmed using the HDL (Hardware Description Language) language.
The EP2C20AF256A7N chip model is known for its low power consumption, high performance, and ease of use. It is also known for its scalability, which allows it to be used in a wide range of applications, from consumer electronics to industrial applications. Additionally, the chip model's small size and low cost make it an attractive option for many applications.
The EP2C20AF256A7N chip model is expected to be in high demand in the future, as the demand for low-power, high-performance FPGAs continues to grow. This is especially true in the areas of artificial intelligence, machine learning, and other intelligent systems, where the chip model's scalability and low power consumption make it an ideal choice.
The EP2C20AF256A7N chip model is also expected to be used in the future in network-related applications, such as data centers, cloud computing, and edge computing. Additionally, the chip model is expected to be used in intelligent scenarios, such as autonomous vehicles and robotics, as well as in the era of fully intelligent systems. In these scenarios, the chip model's scalability and low power consumption will make it an ideal choice.
Overall, the EP2C20AF256A7N chip model is a powerful and versatile model that is suitable for a wide range of applications. Its low power consumption, high performance, scalability, and low cost make it an attractive option for many applications, and its expected demand in the future is expected to be high. The chip model is expected to be used in network-related applications as well as in intelligent scenarios, and it is expected to be a key component of the era of fully intelligent systems.
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5,680 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $128.0717 | $128.0717 |
| 10+ | $126.6946 | $1,266.9458 |
| 100+ | $119.8090 | $11,980.9005 |
| 1000+ | $112.9234 | $56,461.7150 |
| 10000+ | $103.2836 | $103,283.6250 |
| The price is for reference only, please refer to the actual quotation! | ||