Intel Corporation
EP2AGZ350FH29C3N
EP2AGZ350FH29C3N ECAD Model
EP2AGZ350FH29C3N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Number of Inputs | 281 | |
| Number of Outputs | 281 | |
| Number of Logic Cells | 348500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 0.9,1.2/3.3,1.5,2.5 V | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA780,28X28,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP2AGZ350FH29C3N Datasheet Download
EP2AGZ350FH29C3N Overview
The chip model EP2AGZ350FH29C3N is a state-of-the-art device that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is designed to meet the demands of the modern world, where speed and accuracy are essential.
The EP2AGZ350FH29C3N chip model is designed with several advantages that make it stand out from other models. Firstly, it has a high-performance architecture that allows for the efficient processing of complex data. Secondly, it is designed to be power-efficient, allowing for longer battery life in portable devices. Thirdly, it is designed to be highly reliable, with a low failure rate and long life-span. Finally, it is designed to be easy to use, with a user-friendly interface and comprehensive documentation.
The demand for the EP2AGZ350FH29C3N chip model is expected to grow in the future, as more industries turn to advanced digital signal processing, embedded processing, and image processing solutions. It is also expected to be used in more advanced communication systems, such as 5G networks, which require faster and more reliable data processing.
The original design intention of the EP2AGZ350FH29C3N chip model was to provide a powerful, reliable, and efficient solution for digital signal processing, embedded processing, and image processing. It has been designed with the latest technologies and is capable of meeting the most demanding requirements. The chip model is also upgradable, allowing users to keep up with the latest developments in the field.
The EP2AGZ350FH29C3N chip model is capable of being used in advanced communication systems, such as 5G networks. It is designed to handle the high data rates and low latency that are required for these types of systems. Additionally, it has been designed to be highly reliable and secure, ensuring that data is kept safe and that communication is not disrupted.
Overall, the chip model EP2AGZ350FH29C3N is an excellent choice for digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is designed to be powerful, reliable, and efficient, and is capable of being used in advanced communication systems. Additionally, it is upgradable, allowing users to keep up with the latest developments in the field.
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1,204 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,678.4009 | $2,678.4009 |
| 10+ | $2,649.6009 | $26,496.0092 |
| 100+ | $2,505.6009 | $250,560.0870 |
| 1000+ | $2,361.6008 | $1,180,800.4100 |
| 10000+ | $2,160.0008 | $2,160,000.7500 |
| The price is for reference only, please refer to the actual quotation! | ||