Intel Corporation
EP2AGZ350FF35I4N
EP2AGZ350FF35I4N ECAD Model
EP2AGZ350FF35I4N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 554 | |
| Number of Outputs | 554 | |
| Number of Logic Cells | 348500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 500 MHz | |
| Power Supplies | 0.9,1.2/3.3,1.5,2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 35 X 35 MM, LEAD FREE, MS-034, FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP2AGZ350FF35I4N Datasheet Download
EP2AGZ350FF35I4N Overview
The chip model EP2AGZ350FF35I4N is a high-performance digital signal processing (DSP) chip for embedded processing and image processing. It is designed to be highly efficient, reliable, and cost-effective, making it an ideal choice for a wide range of applications. The chip is designed to be used with the HDL (Hardware Description Language) language, meaning that it can be programmed to perform a variety of functions.
The original design intention of the EP2AGZ350FF35I4N was to provide a powerful processor for embedded processing and image processing applications. It is designed to be highly efficient, reliable, and cost-effective, making it an ideal choice for a wide range of applications. The chip is also designed to be compatible with a variety of hardware components, allowing for easy integration into existing systems.
The EP2AGZ350FF35I4N can be used for a variety of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It is also capable of being upgraded to support advanced communication systems. The chip is designed to be highly efficient and reliable, making it a great choice for a wide range of applications.
The product description and specific design requirements of the EP2AGZ350FF35I4N are outlined in its datasheet. The datasheet provides detailed information about the chip's features, specifications, and design requirements. It also includes actual case studies and recommendations for use, as well as precautions to take when working with the chip.
The EP2AGZ350FF35I4N is a powerful and reliable chip designed for a variety of applications. It is designed to be used with the HDL language, meaning that it can be programmed to perform a variety of functions. The chip is designed to be highly efficient and reliable, making it an ideal choice for a wide range of applications. The datasheet provides detailed information about the chip's features, specifications, and design requirements, as well as actual case studies and recommendations for use.
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4,591 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,856.9613 | $2,856.9613 |
| 10+ | $2,826.2413 | $28,262.4129 |
| 100+ | $2,672.6412 | $267,264.1218 |
| 1000+ | $2,519.0411 | $1,259,520.5740 |
| 10000+ | $2,304.0011 | $2,304,001.0500 |
| The price is for reference only, please refer to the actual quotation! | ||