EP2AGZ350FF35I3
EP2AGZ350FF35I3
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

EP2AGZ350FF35I3


EP2AGZ350FF35I3
F18-EP2AGZ350FF35I3
Active
IC FPGA 554 I/O 1152FBGA
1152-FBGA (35x35)

EP2AGZ350FF35I3 ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

EP2AGZ350FF35I3 Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
JESD-609 Code e0
Terminal Finish TIN LEAD
Ihs Manufacturer ALTERA CORP
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Package Description ,

EP2AGZ350FF35I3 Overview



The chip model EP2AGZ350FF35I3 is a complex and powerful integrated circuit that has been developed for a wide range of applications. It has been designed to provide a high level of performance, reliability and flexibility. This chip model is ideal for applications that require high speed processing, low power consumption and a wide range of communication protocols.


The chip model EP2AGZ350FF35I3 is a highly integrated circuit that combines multiple functions on one chip. It is designed to be used in a wide range of applications, including communication systems, industrial automation, medical devices, consumer electronics, and automotive applications. The chip model is equipped with a powerful processor and a wide range of communication protocols. This makes it suitable for a variety of applications, including high-speed data transfer, wireless communication, and industrial control.


The chip model EP2AGZ350FF35I3 has been designed to meet the latest industry standards. It is designed to be compatible with a wide range of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee. The chip model is also designed to be compatible with a wide range of operating systems, including Windows, Linux, and Android. The chip model is also designed to be compatible with a wide range of hardware platforms, including ARM, MIPS, and PowerPC.


To ensure that the chip model EP2AGZ350FF35I3 is suitable for the application environment, it is important to understand the design requirements and actual case studies. It is important to understand the design requirements for the chip model, including the power consumption, the operating temperature range, and the communication protocols. It is also important to understand the actual case studies, including the type of application, the size of the system, and the communication protocols.


In terms of industry trends, the chip model EP2AGZ350FF35I3 is designed to be compatible with the latest industry standards. It is designed to be suitable for a wide range of applications, including communication systems, industrial automation, medical devices, consumer electronics, and automotive applications. As the industry evolves, the chip model is designed to be able to keep up with the latest trends. In terms of future upgrades, the chip model is designed to be able to keep up with the latest technologies.


In conclusion, the chip model EP2AGZ350FF35I3 is a powerful and reliable integrated circuit that is designed to meet the latest industry standards. It is designed to be suitable for a wide range of applications, including communication systems, industrial automation, medical devices, consumer electronics, and automotive applications. It is important to understand the design requirements and actual case studies in order to ensure that the chip model is suitable for the application environment. In terms of industry trends and future upgrades, the chip model is designed to be able to keep up with the latest technologies.



3,598 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote