
Intel Corporation
EP2AGZ350FF35C4N
EP2AGZ350FF35C4N ECAD Model
EP2AGZ350FF35C4N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 554 | |
Number of Outputs | 554 | |
Number of Logic Cells | 348500 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 500 MHz | |
Power Supplies | 0.9,1.2/3.3,1.5,2.5 V | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | 35 X 35 MM, LEAD FREE, MS-034, FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP2AGZ350FF35C4N Datasheet Download
EP2AGZ350FF35C4N Overview
The EP2AGZ350FF35C4N chip model is a highly advanced semiconductor device designed to enable efficient and reliable communication between multiple electronic components. It is designed to be used in high-speed communication systems, with a maximum data transfer rate of up to 350 Mbps. It is also capable of supporting various high-speed protocols such as Ethernet, USB, and Wi-Fi.
The EP2AGZ350FF35C4N chip model is designed with a high level of flexibility, allowing for future upgrades and customizations. It is capable of supporting advanced communication systems such as 5G networks and IoT networks. It is also capable of being used in the era of fully intelligent systems, as it can be used to control and manage various intelligent devices.
The EP2AGZ350FF35C4N chip model is designed with specific requirements in mind. It is equipped with a wide range of features, such as built-in error correction, high-speed data transfer, and low power consumption. It also offers superior performance and reliability, with a low failure rate. To ensure the best performance, it is important to follow the product instructions and adhere to the recommended precautions.
Case studies have demonstrated the effectiveness of the EP2AGZ350FF35C4N chip model in various scenarios. It has been used in a variety of applications, such as industrial automation, medical systems, and automotive systems. It has also been used in advanced communication systems, such as 5G networks and IoT networks. The chip model has demonstrated superior performance in each of these scenarios, with low failure rates and high data transfer speeds.
In conclusion, the EP2AGZ350FF35C4N chip model is a highly advanced semiconductor device designed to enable efficient and reliable communication between multiple electronic components. It is designed with a high level of flexibility, allowing for future upgrades and customizations. It is capable of supporting advanced communication systems such as 5G networks and IoT networks, as well as being used in the era of fully intelligent systems. Case studies have demonstrated the effectiveness of the chip model in various scenarios, with superior performance and reliability. It is important to adhere to the product instructions and recommended precautions in order to ensure the best performance.
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1,306 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,380.8009 | $2,380.8009 |
10+ | $2,355.2009 | $23,552.0092 |
100+ | $2,227.2009 | $222,720.0870 |
1000+ | $2,099.2008 | $1,049,600.4100 |
10000+ | $1,920.0008 | $1,920,000.7500 |
The price is for reference only, please refer to the actual quotation! |