EP2AGZ350FF35C4N
EP2AGZ350FF35C4N
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rohs

Intel Corporation

EP2AGZ350FF35C4N


EP2AGZ350FF35C4N
F18-EP2AGZ350FF35C4N
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 35 X 35 MM, LEAD FREE, MS-034, FBGA-1152
35 X 35 MM, LEAD FREE, MS-034, FBGA-1152

EP2AGZ350FF35C4N ECAD Model


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EP2AGZ350FF35C4N Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 554
Number of Outputs 554
Number of Logic Cells 348500
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 500 MHz
Power Supplies 0.9,1.2/3.3,1.5,2.5 V
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
JESD-609 Code e1
Operating Temperature-Max 85 °C
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer INTEL CORP
Package Description 35 X 35 MM, LEAD FREE, MS-034, FBGA-1152
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP2AGZ350FF35C4N Datasheet Download


EP2AGZ350FF35C4N Overview



The EP2AGZ350FF35C4N chip model is a highly advanced semiconductor device designed to enable efficient and reliable communication between multiple electronic components. It is designed to be used in high-speed communication systems, with a maximum data transfer rate of up to 350 Mbps. It is also capable of supporting various high-speed protocols such as Ethernet, USB, and Wi-Fi.


The EP2AGZ350FF35C4N chip model is designed with a high level of flexibility, allowing for future upgrades and customizations. It is capable of supporting advanced communication systems such as 5G networks and IoT networks. It is also capable of being used in the era of fully intelligent systems, as it can be used to control and manage various intelligent devices.


The EP2AGZ350FF35C4N chip model is designed with specific requirements in mind. It is equipped with a wide range of features, such as built-in error correction, high-speed data transfer, and low power consumption. It also offers superior performance and reliability, with a low failure rate. To ensure the best performance, it is important to follow the product instructions and adhere to the recommended precautions.


Case studies have demonstrated the effectiveness of the EP2AGZ350FF35C4N chip model in various scenarios. It has been used in a variety of applications, such as industrial automation, medical systems, and automotive systems. It has also been used in advanced communication systems, such as 5G networks and IoT networks. The chip model has demonstrated superior performance in each of these scenarios, with low failure rates and high data transfer speeds.


In conclusion, the EP2AGZ350FF35C4N chip model is a highly advanced semiconductor device designed to enable efficient and reliable communication between multiple electronic components. It is designed with a high level of flexibility, allowing for future upgrades and customizations. It is capable of supporting advanced communication systems such as 5G networks and IoT networks, as well as being used in the era of fully intelligent systems. Case studies have demonstrated the effectiveness of the chip model in various scenarios, with superior performance and reliability. It is important to adhere to the product instructions and recommended precautions in order to ensure the best performance.



1,306 In Stock


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Unit Price: $2,560.001
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,380.8009 $2,380.8009
10+ $2,355.2009 $23,552.0092
100+ $2,227.2009 $222,720.0870
1000+ $2,099.2008 $1,049,600.4100
10000+ $1,920.0008 $1,920,000.7500
The price is for reference only, please refer to the actual quotation!

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