Intel Corporation
EP2AGZ300FF35I3N
EP2AGZ300FF35I3N ECAD Model
EP2AGZ300FF35I3N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 554 | |
| Number of Outputs | 554 | |
| Number of Logic Cells | 298000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 500 MHz | |
| Power Supplies | 0.9,1.2/3.3,1.5,2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 35 X 35 MM, LEAD FREE, MS-034, FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP2AGZ300FF35I3N Datasheet Download
EP2AGZ300FF35I3N Overview
The chip model EP2AGZ300FF35I3N is a cutting-edge product of the semiconductor industry, and its design intention is to provide a powerful, efficient, and cost-effective solution to meet the needs of modern electronic systems. It is a powerful device that can be used in a variety of applications, including communication systems, networks, and other intelligent scenarios.
In terms of industry trends, the chip model EP2AGZ300FF35I3N is a highly reliable, low-cost solution that meets the needs of modern electronic systems. It is capable of providing a high degree of performance, efficiency, and cost-effectiveness for a variety of applications. In addition, it is capable of supporting the latest technologies, such as 5G networks, AI, and IoT, and is capable of being used in the era of fully intelligent systems.
In terms of future development, the chip model EP2AGZ300FF35I3N is designed to be upgradeable, allowing for future upgrades to meet the changing needs of the market. It is also capable of being used in advanced communication systems, such as 5G networks, and is capable of being used in intelligent scenarios, such as AI and IoT. Furthermore, it is also capable of being used in the era of fully intelligent systems, allowing for the development of more advanced applications.
In conclusion, the chip model EP2AGZ300FF35I3N is a powerful and reliable device that is capable of meeting the needs of modern electronic systems. It is capable of providing a high degree of performance, efficiency, and cost-effectiveness for a variety of applications. It is also capable of supporting the latest technologies, such as 5G networks, AI, and IoT, and is capable of being used in the era of fully intelligent systems. Furthermore, it is designed to be upgradeable, allowing for future upgrades to meet the changing needs of the market.
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4,582 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,958.1453 | $2,958.1453 |
| 10+ | $2,926.3373 | $29,263.3729 |
| 100+ | $2,767.2972 | $276,729.7218 |
| 1000+ | $2,608.2571 | $1,304,128.5740 |
| 10000+ | $2,385.6011 | $2,385,601.0500 |
| The price is for reference only, please refer to the actual quotation! | ||