Intel Corporation
EP2AGZ225FF35I3N
EP2AGZ225FF35I3N ECAD Model
EP2AGZ225FF35I3N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 554 | |
| Number of Outputs | 554 | |
| Number of Logic Cells | 224000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 500 MHz | |
| Power Supplies | 0.9,1.2/3.3,1.5,2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Pin Count | 1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP2AGZ225FF35I3N Overview
The chip model EP2AGZ225FF35I3N is a revolutionary product designed for advanced digital signal processing, embedded processing, image processing, and many other modern applications. It is designed with the HDL (Hardware Description Language) language, which can be used to describe the behavior of the chip and its components. This chip model was created to provide users with the highest performance and reliability, making it suitable for a wide range of applications.
The original design intention of the EP2AGZ225FF35I3N was to provide the highest performance and reliability for users. It was designed to be able to handle any kind of processing tasks, no matter how complex they may be. With its advanced features, this chip model can provide users with the most efficient and reliable computing power. Furthermore, it is also designed to be upgradable, allowing users to add more features or to upgrade the existing features as needed.
The EP2AGZ225FF35I3N is also suitable for use in advanced communication systems. This chip model is designed to provide users with the highest performance and reliability when it comes to transmitting and receiving data. It can also be used to process and store data, making it ideal for use in networks. Furthermore, this chip model can be used to create intelligent systems, allowing users to control their systems with ease.
The EP2AGZ225FF35I3N is also suitable for use in the era of fully intelligent systems. This chip model is designed to provide users with the highest performance and reliability when it comes to processing and storing data, as well as controlling their systems. In addition, this chip model can also be used to create intelligent systems, allowing users to easily control their systems with ease.
In conclusion, the chip model EP2AGZ225FF35I3N is an excellent choice for any user looking for the highest performance and reliability when it comes to digital signal processing, embedded processing, image processing, and other modern applications. It is designed with the HDL language, making it suitable for use in advanced communication systems and intelligent systems. Furthermore, it is designed to be upgradable, allowing users to add more features or to upgrade the existing features as needed.
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3,135 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||