Intel Corporation
EP2AGX45CU17I3
EP2AGX45CU17I3 ECAD Model
EP2AGX45CU17I3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 156 | |
| Number of Outputs | 156 | |
| Number of Logic Cells | 42959 | |
| Number of CLBs | 1805 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 1805 CLBS | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B358 | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 358 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA358,20X20,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP2AGX45CU17I3 Datasheet Download
EP2AGX45CU17I3 Overview
The FPGA chip model EP2AGX45CU17I3 is a powerful tool for high-performance digital signal processing, embedded processing, image processing, and other applications. This model is designed with the HDL language, which is a hardware description language that allows engineers to create complex digital designs and deploy them in a wide variety of applications.
The original design intention of EP2AGX45CU17I3 is to provide an advanced FPGA solution for a wide range of applications. It has the capability to provide high-performance digital signal processing and embedded processing capabilities. It also has the ability to support image processing and other applications. The model can be upgraded to provide more advanced features and capabilities.
The EP2AGX45CU17I3 chip model can be applied to the development and popularization of future intelligent robots. It has the capability to provide powerful digital signal processing, embedded processing, and image processing capabilities. This model is designed to be used in a variety of applications, including communication systems. It can be used to help create efficient and reliable communication systems that can be used in a variety of settings.
Using the EP2AGX45CU17I3 effectively requires a certain level of technical knowledge and skills. Engineers need to be familiar with the HDL language and the capabilities of the chip model. They also need to understand the design process and be able to create complex digital designs. Additionally, they need to be able to troubleshoot any issues that may arise during the development process.
In conclusion, the EP2AGX45CU17I3 chip model is a powerful tool for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used in a variety of settings, including communication systems. It can be used to help create efficient and reliable communication systems. Engineers need to be familiar with the HDL language and the capabilities of the chip model in order to use it effectively.
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3,595 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $308.5070 | $308.5070 |
| 10+ | $305.1898 | $3,051.8976 |
| 100+ | $288.6034 | $28,860.3360 |
| 1000+ | $272.0170 | $136,008.4800 |
| 10000+ | $248.7960 | $248,796.0000 |
| The price is for reference only, please refer to the actual quotation! | ||