EP2AGX260EF29I3N
EP2AGX260EF29I3N
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Intel Corporation

EP2AGX260EF29I3N


EP2AGX260EF29I3N
F18-EP2AGX260EF29I3N
Active
IC FPGA 372 I/O 780FBGA
780-FBGA (29x29)

EP2AGX260EF29I3N ECAD Model


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EP2AGX260EF29I3N Attributes


Type Description Select
Mfr Intel
Series Arria II GX
Package Tray
Number of LABs/CLBs 10260
Number of Logic Elements/Cells 244188
Total RAM Bits 12038144
Number of I/O 372
Voltage - Supply 0.87V ~ 0.93V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-FBGA (29x29)
Base Product Number EP2AGX260

EP2AGX260EF29I3N Overview



The EP2AGX260EF29I3N is an advanced FPGA chip from Altera Corporation. It is part of the Cyclone II family and is based on a 1.2V single-chip architecture. The chip has a total of 260,000 logic elements and up to 1,536 Kbits of embedded RAM. It has dedicated logic to support high-speed serial transceivers and is designed to provide a low-power, cost-effective solution for a wide range of applications.


The EP2AGX260EF29I3N has a wide range of features and capabilities, including high-speed transceivers, high-speed memory interfaces, high-speed logic, and embedded memory. It supports a wide range of I/O standards, including LVDS, PCI Express, USB, and Ethernet. It also features Altera's high-performance DSP blocks and hardened IP cores.


The EP2AGX260EF29I3N is ideal for applications such as industrial automation, medical imaging, video and image processing, embedded systems, and high-speed networking. It is also suitable for use in automotive, aerospace, and military applications. The chip is designed to be used in a wide range of environments, including harsh conditions and high-temperature environments.


In conclusion, the EP2AGX260EF29I3N is an advanced FPGA chip from Altera Corporation. It features a wide range of features and capabilities, including high-speed transceivers, high-speed memory interfaces, and embedded memory. It is suitable for a wide range of applications, including industrial automation, medical imaging, video and image processing, embedded systems, and high-speed networking.



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