
Intel Corporation
EP2AGX260EF29I3N
EP2AGX260EF29I3N ECAD Model
EP2AGX260EF29I3N Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Arria II GX | |
Package | Tray | |
Number of LABs/CLBs | 10260 | |
Number of Logic Elements/Cells | 244188 | |
Total RAM Bits | 12038144 | |
Number of I/O | 372 | |
Voltage - Supply | 0.87V ~ 0.93V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 780-BBGA, FCBGA | |
Supplier Device Package | 780-FBGA (29x29) | |
Base Product Number | EP2AGX260 |
EP2AGX260EF29I3N Overview
The EP2AGX260EF29I3N is an advanced FPGA chip from Altera Corporation. It is part of the Cyclone II family and is based on a 1.2V single-chip architecture. The chip has a total of 260,000 logic elements and up to 1,536 Kbits of embedded RAM. It has dedicated logic to support high-speed serial transceivers and is designed to provide a low-power, cost-effective solution for a wide range of applications.
The EP2AGX260EF29I3N has a wide range of features and capabilities, including high-speed transceivers, high-speed memory interfaces, high-speed logic, and embedded memory. It supports a wide range of I/O standards, including LVDS, PCI Express, USB, and Ethernet. It also features Altera's high-performance DSP blocks and hardened IP cores.
The EP2AGX260EF29I3N is ideal for applications such as industrial automation, medical imaging, video and image processing, embedded systems, and high-speed networking. It is also suitable for use in automotive, aerospace, and military applications. The chip is designed to be used in a wide range of environments, including harsh conditions and high-temperature environments.
In conclusion, the EP2AGX260EF29I3N is an advanced FPGA chip from Altera Corporation. It features a wide range of features and capabilities, including high-speed transceivers, high-speed memory interfaces, and embedded memory. It is suitable for a wide range of applications, including industrial automation, medical imaging, video and image processing, embedded systems, and high-speed networking.
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